A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200? C. is expressed as ?1 [K.sup.?1], at least one of requirements ?1/?2?10 and (?1??2).sup.2?10.sup.8?0.4 is satisfied, where a reference value ?2 is 350?10.sup.?6 [K.sup.?1] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09?Ia/Ib?3.0 and 0.04?Ic/Ib?1.0 are satisfied.

The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.

A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1):

##STR00001##

wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2):

##STR00002##

wherein Y is a bond, a C.sub.1-6 alkylene group, etc.;

R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc.,

R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc.,

R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and

n is the same or different, and is an integer of 0 to 3.

The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

A coating material includes a modified particle and a reactive compound. The modified particle includes a core, and a silane coupling agent having an epoxy group (or a double-bond) grafted onto a surface of the core. When the silane coupling agent having the epoxy group is grafted onto the surface of the core, the reactive compound includes a non-silicon multi-epoxy compound and a silicon-containing multi-epoxy compound. When the silane coupling agent having the double-bond is grafted onto the surface of the core, the reactive compound includes a multi double-bond compound.

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator,

##STR00001##

wherein A represents a single bond or a divalent organic group selected from the following formulae.

##STR00002##

This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.

An expansion polymerization imprinting glue for nano-imprinting. Raw materials required for the preparation of the expansion polymerization imprinting glue comprise a low polymer and an expansion monomer. Compared with the prior art, after the expansion monomer is introduced into the expansion polymerization imprinting glue for nano-imprinting, the expansion monomer can be polymerized with the low polymer, the volume change of the imprinting glue after polymerization can be adjusted, and accordingly the volume shrinkage after the imprinting glue is cured is reduced or even eliminated; and the imprinting glue having zero curing shrinkage or volume expansion can be obtained by adjusting the content of the expansion monomer. The imprinting glue can effectively reduce the residual stress in a micro-nano pattern, and the generation of pattern defects in the nano-imprinting demolding process caused by the residual stress is reduced while accurate pattern copying is implemented.

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.

The present invention provides a polyorganosiloxane compound having a low viscosity, a process for the manufacture of such polyorganosiloxane compounds, polyorganosiloxane compositions comprising said polyorganosiloxane compound and another polyorganosiloxane compound which is different from the polyorganosiloxane compound, aqueous emulsions comprising the polyorganosiloxane compound, and a method of surface treatment using the polyorganosiloxane compound.