A fluorine-containing ether compound according to the present invention is a fluorine-containing ether compound represented by the following General Formula (1).

[Chem. 1]

(F.sub.2C.sub.IA-B-D).sub.2(1)

An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23 C. and 50% RH (ASTM D4287); and wherein the ratio between hydrogen equivalents in the curing agent and epoxy equivalents of the coating composition is in the range 50:100 to 120:100.

The present disclosure relates to a reactive flame-proof composition for vinyl polymers, consisting at least of a first monomer and a second monomer that can be polymerised using the first monomer, wherein the first monomer has at least one aliphatic double bond and can be polymerised using the second monomer to form a reactive flame-proof polymer having an aliphatic double bond. The disclosure also relates to: a reactive flame-proof polymer produced by polymerisation of the reactive flame-proof composition; a use of the flame-proof composition and the flame-proof polymer; a flame-resistant vinyl polymer comprising the reactive flame-proof polymer; and methods for the production thereof. The subjects according to the disclosure can in particular advantageously reduce dripping of vinyl polymers during fires and can thus improve the flame-proof nature of such polymers.

A low-loss insulating resin composition and an insulating film using the same are provided. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.

A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being: ##STR00001##
the formula (E1) being: ##STR00002##
the formula (E2) being: ##STR00003##
the formula (E3) being: ##STR00004## Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.

To provide a fluorinated compound capable of obtaining a cured product which is excellent in heat resistance and mold release and has a high Abbe number; a curable composition containing such a compound; and a cured product which is excellent in heat resistance and mold release and has a high Abbe number. The fluorinated compound is represented by the following formula (A):
[ZOCH.sub.2CF.sub.2CF.sub.2CF.sub.2OCFHCF.sub.2X].sub.nQ(A)
where n is an integer of at least 1, Q is a n-valent organic group, X is O, NH or S, and Z is a group having at least one polymerizable functional group.

A liquid discharge head including: a flow path formation part in which pressure generation chambers are arranged; and a pressure generation unit configured to apply pressure to the pressure generation chambers, wherein the pressure generation unit is formed by joining a vibration unit to the flow path formation part with a resin layer, and wherein the resin layer includes a curable resin composition including (A) an epoxy resin, (B) a polythiol compound, (C) at least one adhesiveness-imparting agent selected from the group consisting of a compound represented by General Formula (1), a titanium compound represented by General Formula (2-1), and a titanium compound represented by General Formula (2-2), and (D) a curing accelerator.

##STR00001##

A resin composition includes: (A) 100 parts by weight of an epoxy resin; (B) 10 to 30 parts by weight of a phenoxy resin; (C) 30 to 50 parts by weight of hydrogenated trimellitic anhydride; and (D) 250 to 400 parts by weight of a co-sintered body of aluminum nitride and boron nitride. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including visible light reflectivity, routing distance, flame retardancy and copper foil peeling strength.

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.

A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.