A composition forms a resist underlayer film that enables formation of a desired resist pattern; and a method produces a resist pattern and a method produces a semiconductor device, which each use the resist underlayer film-forming composition. This resist underlayer film-forming composition contains a reaction product obtained from: a compound (A) that is dissolved in a solvent and that is represented by formula (1) (in formula (1), A represents an organic group including an aliphatic ring, an aromatic ring, or a heterocyclic ring); a compound (B) having two functional groups that are reactive with respect to an epoxy group; and a compound (C) having one functional group that is reactive with respect to an epoxy group.

The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

A floor coating agent with excellent adhesion and hardness, and a construction method using the same are proposed. The floor coating agent includes a primer layer applied onto a surface of floor and then cured, and a floor coating layer applied onto the primer layer and then cured, wherein the primer layer is produced from a mixture of a self-emulsified epoxy resin, an acrylic polyol resin, a defoaming agent, 1,3,5-triglycidyl isocyanurate, dodecanedioic acid, anhydrous sodium citrate and water, and the floor coating layer is produced from a floor coating layer composition including an acidic copolymer alkyl ammonium salt, zinc oxide, oxalic acid, ammonium hydroxide and distilled water. Based on this configuration, floor coating agent can improve durability, abrasion resistance, gloss and the like of a floor surface, based on excellent adhesion to the floor surface and superior surface hardness.

A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent:

##STR00001##

(wherein R.sub.1 is a C.sub.1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)

The purpose of the present invention is to provide a prepreg which satisfies one of a)-c): a) having superior storage stability and capable of providing a fiber-reinforced composite material having superior mechanical properties; b) capable of providing a fiber-reinforced composite material having superior mechanical properties, and the obtained fiber-reinforced composite material has superior appearance quality; and c) having superior storage stability, generating less amount of heat when cured, and enabling the cure extent and the viscosity in the B-stage state to be flexibly controlled. To achieve the purpose, the present invention provides a prepreg including reinforced fibers and an epoxy resin composition which contains an epoxy resin and a curing agent represented by a specific chemical formula, and which satisfies a specific condition.

There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: ##STR00001##
wherein R.sup.1 to R.sup.3 each independently are a hydrogen atom or methyl group, and L.sup.1 to L.sup.3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

The present disclosure provides a curable resin system containing an alkylated glycidyl amine and a phenylindane diamine. The curable resin system may be cured at relatively low temperatures to produce cured products having desirable physical, thermal and chemical properties for use in various applications including composites for the aerospace and automotive industries.

Disclosed are compositions relating to optically clear epoxy resin formulations with filler compositions having superior regular transmission of light between 350 nm and 2500 nm, and a low coefficient of thermal expansion, along with optoelectronic devices sealed with the same.

Laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor using a composition having the following (a) to (c): (a) a first organic compound represented by Formula (1) below (R represents a hydrogen atom or a glycidyl group. A plurality of Rs may be identical to or different from each other, but each of at least two Rs is a glycidyl group), (b) a second organic compound represented by Formula (2) below, and (c) a photocationic polymerization initiator ##STR00001##

A composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, each of which uses said composition for forming a resist underlayer film. A resist underlayer film-forming composition includes a solvent and a polymer having a unit structure represented by formula (I):

##STR00001##

(in formula (I), A.sup.1, A.sup.2, A.sup.3, A.sup.4, A.sup.5, and A.sup.6 each independently represent a hydrogen atom, a methyl group, or an ethyl group, Q.sup.1 represents a divalent organic group, R.sup.1 represents a tetravalent organic group including a C6-40 aromatic ring structure, and L.sup.1 and L.sup.2 each independently represent a hydrogen atom or a C1-10 alkyl group optionally substituted with a hydroxy group and optionally interrupted by an oxygen atom).