Disclosed is the use of a lacquer system for producing a lacquer edge coating on an edge of a lens, wherein-the lacquer system comprises at least one first component and one second component and configured to be hardened by irradiation with light of a wavelength in the range from 0.7 m to 1.4 m; wherein the first component comprises at least one resin, at least one diluent, and at least one filler, with the content of the at least one resin in the first component amounting to 20 to 65 wt. % of the first component, with the content of the diluent amounting to 5 to 70 wt. % of the first component, and the content of filler amounting to 2 wt. % of the first component; and wherein the second component comprises at least one crosslinking agent.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

Provided is a thermally curable coating composition for alloy substrates, comprising: curable components, comprising an epoxy resin and a multifunctional (meth)acrylate; latent curing agents, which crosslink with the curable components upon heating, and comprise an isocyanate having at least two NCO groups and an amino resin; a curing promoter, comprising an aromatic phosphate comprising at least one hydroxy group connected with the phosphorous atom; and an organic solvent. Also provided are a method for providing a coating layer onto an alloy substrate and a coating layer thus obtained.

An in-situ formed polyurethane catalyst for catalyzing the formation of polyurethane in a reactive composition comprising polyisocyanate compounds and isocyanate reactive compounds, said catalyst formed by combining in said reactive composition: At least one lithium halide compound, and At least one epoxide compound
wherein the amount of epoxide to be used is such that the number of epoxide equivalents per isocyanate equivalents is from larger than 0 up to 0.095 and the number of moles of lithium halide per isocyanate equivalent ranging of from 0.0001-0.06.

A thermosetting oligomer is disclosed, comprising repeat units of the formula

##STR00001##

wherein Ar is a C.sub.6-32 arylene, preferably a C.sub.13-17 diarylene methylene; R.sup.a and R.sup.b at each occurrence are each independently a halogen, C.sub.1-12 alkyl, C.sub.2-12 alkenyl, C.sub.3-8 cycloalkyl, or C.sub.1-12 alkoxy, preferably a C.sub.1-3 alkyl; R.sup.3 at each occurrence is independently a halogen or a C.sub.1-6 alkyl group, preferably a C.sub.1-3 alkyl; R.sup.4 a C.sub.1-25 hydrocarbyl, preferably a C.sub.1-6 alkyl, a phenyl, or a phenyl substituted with up to five C.sub.1-6 alkyl groups, more preferably a C.sub.1-3 alkyl or a phenyl; and c, p and q at each occurrence are each independently 0 to 4.

A fiber-reinforced molding material of the present invention includes a matrix resin and a reinforcing fiber, wherein the matrix resin includes a reactant of the following component (A) and the following component (B), and the following component (C), and a spiral flow length measured in accordance with EIMS T901 is 300 mm or longer, component (A): a component having one or more ethylenically unsaturated groups in one molecule and including at least one selected from the group consisting of the following component (A-1) and the following component (A-2); component (A-1): an unsaturated polyester resin having one or more ethylenically unsaturated groups and one or more hydroxyl groups in one molecule; component (A-2): an epoxy (meth)acrylate resin having one or more ethylenically unsaturated groups and one or more hydroxyl groups in one molecule; component (B): an isocyanate compound; component (C): a radical polymerization inhibitor having no hydroxyl group in a molecule.

The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.

Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 m or more and 13 m or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.

An object of the present invention is to find a cationic electrodeposition coating composition excellent in throwing power, anti-GA gas pinhole properties, and anti-corrosion properties, and to provide a coated article excellent in these coating film properties. The present invention provides a cationic electrodeposition coating composition containing an amino-containing epoxy resin (A), a blocked polyisocyanate curing agent (B), and a pigment (C), the amino-containing epoxy resin (A) being obtained by reacting an epoxy resin (A1), a polyphenol compound (A2), a dimer acid diglycidyl ester (A3), and an amine compound (A4).

Described herein are processes for producing moldings comprising oxazolidinone groups, where polyisocyanate (a) is mixed with at least one organic compound (b) having two or more epoxide groups, at least one catalyst (c) for the isocyanate/epoxide reaction, and optionally auxiliary and additive materials (d) to form a reaction mixture, which is introduced into or applied to a mold and reacted to give moldings including oxazolidinone groups, where the catalyst (c) for the isocyanate/epoxide reaction includes a compound of the general formula [M(R.sub.1)(R.sub.2)(R.sub.3)(R.sub.4)].sup.+ [X I.sub.n].sup., where M is a nitrogen atom or a phosphorus atom, R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are an organic radical, X is fluorine, chlorine, bromine or iodine, I is iodine, and n stands for rational numbers from 0.1 to 10.