A HALOGEN-FREE EPOXY RESIN COMPOSITION AND A PREPREG AND A LAMINATE USING THE SAME

Abstract

The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.

Claims

1.-10. (canceled)

11. A halogen-free epoxy resin composition comprising the following components: (A) a halogen-free epoxy resin; (B) an active ester resin; (C) a reactive phosphorous-containing flame retardant; wherein the reactive phosphorous-containing flame retardant has the following structure: ##STR00006## wherein R is ##STR00007## X is ##STR00008## wherein Y is a substituted phenyl, an unsubstituted phenyl, a substituted naphthyl or an unsubstituted naphthyl; Z does not exist or is a group selected from CH.sub.2 or ##STR00009## n and m are integers independently selected from 0 to 2, and n+m is an integer greater than r equal to 1.

12. The halogen-free epoxy resin composition according to claim 11, wherein the halogen-free epoxy resin is any one or a mixture of at least two of biphenyl novolac epoxy resin, DCPD-type novolac epoxy resin, alkylene novolac epoxy resin or bisphenol A novolac epoxy resin.

13. The halogen-free epoxy resin composition according to claim 11, wherein the active ester resin has the following structure: ##STR00010## wherein X is phenyl or naphthyl; j is 0 or 1; k is 0 or 1; n represents a repeating unit and is from 0.25 to 1.25.

14. The halogen-free epoxy resin composition according to claim 13, wherein based on 100 parts by weight of the halogen-free epoxy resin, the active ester resin is added in an amount of 11 to 37 parts by weight; wherein based on 100 parts by weight of the halogen-free epoxy resin, the reactive phosphorous-containing flame retardant is added in an amount of 40 to 66 parts by weight.

15. The halogen-free epoxy resin composition according to claim 11, wherein the halogen-free epoxy resin composition further comprises a cyanate ester or a prepolymer thereof.

16. The halogen-free epoxy resin composition according to claim 15, wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the cyanate ester or the prepolymer thereof is added in an amount of 10 to 20 parts by weight.

17. The halogen-free epoxy resin composition according to claim 11, wherein the halogen-free epoxy resin composition further comprises a curing accelerator.

18. The halogen-free epoxy resin composition according to claim 17, wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the curing accelerator is added in an amount of 0.05 to 1 part by weight.

19. The halogen-free epoxy resin composition according to claim 17, wherein the curing accelerator is any one or a mixture of at least two of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole or zinc isocaprylate.

20. The halogen-free epoxy resin composition according to claim 11, wherein the halogen-free epoxy resin composition further comprises a flame-retardant compound.

21. The halogen-free epoxy resin composition according to claim 20, wherein the flame-retardant compound is a flame-retardant salt.

22. The halogen-free epoxy resin composition according to claim 21, wherein the flame-retardant compound is a phosphate compound or a nitrogen-containing phosphate compound.

23. The halogen-free epoxy resin composition according to claim 20, wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the flame-retardant compound is added in an amount of 0 to 50 parts by weight and 0 is excluded.

24. The halogen-free epoxy resin composition according to claim 11, wherein the halogen-free epoxy resin composition further comprises a filler.

25. The halogen-free epoxy resin composition according to claim 24, wherein the filler is an organic and/or an inorganic filler.

26. The halogen-free epoxy resin composition according to claim 24, wherein based on 100 parts by weight of the sum of the halogen-free epoxy resin, the active ester resin and the reactive phosphorous-containing flame retardant, the filler is added in an amount of 0 to 100 parts by weight and 0 is excluded.

27. The halogen-free epoxy resin composition according to claim 25, wherein the inorganic filler is any one or a mixture of at least two of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, alumina, talc powder, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica or glass fiber powder; wherein the organic filler is any one or a mixture of at least two of polytetrafluoroethylene powder, polyphenylene sulfide or polyether sulfone powder.

28. The halogen-free epoxy resin composition according to claim 24, wherein the filler is silica, the median particle size of the filler is from 1 to 15 m.

29. A prepreg comprising a reinforcing material and a halogen-free epoxy resin composition according to claim 11 adhered thereon after being impregnated and dried.

30. A laminate comprising at least one prepreg according to claim 29.

Description

DETAILED DESCRIPTION

[0046] To facilitate the understanding of the present disclosure, the following embodiments are listed below. It will be apparent to those skilled in the art that the embodiments are merely illustrations of the present disclosure and should not be construed as specific limitations thereto.

[0047] The metal-clad laminate made from the halogen-free epoxy resin composition according to the above procedures was tested for its inter-laminar adhesive force, coefficient of thermal expansion and flammability. The following examples are used for detailed illustration and description, in which the part by weight of the organic resin is based on that of the organic solid content.

PREPARATION EXAMPLE 1

Preparation of the Reactive Phosphorous-Containing Flame Retardant B1

[0048] 490 g of bisphenol F, 324 g of formaldehyde aqueous solution (mass concentration of 37%) and 24 g of sodium hydroxide were added into a reaction kettle and stirred, then the obtained mixture was heated to a temperature of 40 C. and kept at that temperature for 3 hours; afterwards, the temperature was raised to 65 C. and kept at that temperature for 3 hours, after which 1480 g of n-butanol was added and refluxed for 12 hours; then the temperature of the materials was reduced to 55 to 60 C., and about 1000 g of n-butanol was removed by distillation under reduced pressure to obtain an intermediate.

[0049] 1080 g of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) was added into the intermediate, then the temperature of the materials was gradually raised from 80 C. to 190 C. in 2 hours, after which reduced pressure was applied to the system at 120 C. to ensure that n-butanol was removed from the system in time. The temperature of the materials was kept at 180 C. for 1 hour, then it was reduced to 135 C., and about 900 g of propylene glycol methyl ether was added thereto. The mixture was continuously stirred for 0.5 hour and discharged to obtain a phosphorus-based curing agent A1.

[0050] To a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube and a stirrer, 1 mol of A2 and 816 g of methyl isobutyl ketone (MIBK) were added, and then the system was displaced with nitrogen under reduced pressure to dissolve them. Next, 0.9 mol of paraphthaloyl chloride was added to react for 2 hours. The temperature in the system was controlled below 60 C. Then, 1.2 mol of phenol was added into the system to continue the reaction for 1 hour. Under a nitrogen condition, 189 g of 20% sodium hydroxide aqueous solution was dropwise added slowly, and continuously stirred under such condition for 1 hour. After the reaction, the mixture was left to stand still for liquid separation, and then the aqueous layer was removed. Water was added to the MIBK phase in which the reactants were dissolved, followed by stirring to mix, then the obtained mixture was left to stand still and the aqueous layer was removed. The above operations were repeated until the pH of the aqueous layer reached about 7.0. Then, water was removed by a decanter, followed by distillation under reduced pressure to remove MIBK to obtain the reactive phosphorous-containing flame retardant B1 having an ester group equivalent of 223 g/mol.

PREPARATION EXAMPLE 2

Preparation of the Reactive Phosphorous-Containing Flame Retardant B2

[0051] 372 g of dihydroxy diphenyl, 324 g of formaldehyde aqueous solution (mass concentration of 37%) and 24 g of sodium hydroxide were added into a reaction kettle, then stirring was started, the mixture was heated to a temperature of 40 C. and kept at that temperature for 3 hours; then the temperature was raised to 65 C. and kept at that temperature for 3 hours, after which 1480 g of n-butanol was added and refluxed for 12 hours; then the temperature of the materials was reduced to 55 to 60 C., and about 1000 g of n-butanol was removed by distillation under reduced pressure to obtain an intermediate.

[0052] 1080 g of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) was added into the intermediate, and then the temperature of the materials was gradually raised from 80 C. to 190 C. in 2 hours, after which reduced pressure was applied to the system at 120 C. to ensure that n-butanol was removed from the system in time. The temperature of the materials was kept at 180 C. for 1 hour, then it was reduced to 135 C., and about 900 g of propylene glycol methyl ether was added thereto. The mixture was continuously stirred for 0.5 hour and discharged to obtain a phosphorus-based curing agent A2.

[0053] To a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube and a stirrer, 1 mol of A2 and 816 g of methyl isobutyl ketone (MIBK) were added, and the system was displaced with nitrogen under reduced pressure to dissolve them. Next, 0.9 mol of paraphthaloyl chloride was added to react for 2 hours. The temperature in the system was controlled below 60 C. Then, 1.2 mol of phenol was added into the system to continue the reaction for 1 hour. Under a nitrogen condition, 189 g of 20% sodium hydroxide aqueous solution was dropwise added slowly, and continuously stirred under this condition for 1 hour. After the reaction, the mixture was left to stand still for liquid separation, and then the aqueous layer was removed. Water was added to the MIBK phase in which the reactants were dissolved, followed by stirring to mix, then the obtained mixture was left to stand still and the aqueous layer was removed. The above operations were repeated until the pH of the aqueous layer reached about 7.0. Then, water was removed by a decanter, followed by distillation under reduced pressure to remove MIBK to obtain the reactive phosphorous-containing flame retardant B2 having an ester group equivalent of 226 g/mol.

EXAMPLE 1

[0054] To a container, 100 parts by weight of 7200-H and an appropriate amount of MEK were added, then the mixture was stirred and dissolved, after which 37 parts by weight of HPC-8000-65T, 40 parts by weight of the reactive phosphorous-containing flame retardant of the Preparation Example 1, 76 parts by weight of the silica powder 525 and 0.76 part by weight of BYK-W903 were added thereto, stirred and an appropriate amount of curing accelerator DMAP was added, then continuously stirred to mix well, finally the solid content of the liquid was adjusted to 60 to 70% with a solvent to prepare a glue solution.

[0055] A glass fiber cloth was impregnated with the glue solution prepared above, i.e. a gelling solution. A glass fiber cloth having a size of 2116 was impregnated with the glue solution obtained above and controlled to be a prepreg having a resin content of 50%, then oven-dried to remove the solvent to obtain a prepreg. 6 pieces of the prepregs obtained above were laminated with each other, both sides of which were claded with a piece of copper foil, respectively, then put into a hot press to be cured to obtain the epoxy resin copper-clad laminate. Data of physical properties were shown in Table 1.

EXAMPLES 2-8

[0056] Production processes were the same as those of Example 1, and the components of the formulation and their physical indexes were shown in Table 1.

COMPARATIVE EXAMPLES 1-5

[0057] Production processes were the same as those of Example 1, and the components of the formulation and their physical indexes were shown in Table 2.

[0058] Note: In the tables, the amount of the solid component was based on parts by weight.

[0059] The specific materials listed in Table 1 and Table 2 was as follows:

[0060] B1: the reactive phosphorous-containing flame retardant obtained in the Preparation Example 1.

[0061] B2: the reactive phosphorous-containing flame retardant obtained in the Preparation Example 2.

[0062] B3: the material having the following structure in Patent CN105906785A:

##STR00005##

[0063] wherein R is an alkyl group containing 1 to 8 carbon atoms or a substituted or unsubstituted phenyl group.

[0064] 2812: linear novolac resin (tradename of Korean Momentive).

[0065] 92741: phosphorous-containing novolac resin (tradename of DOW).

[0066] NC-3000H: biphenyl novolac epoxy resin (tradename of Nippon Kayaku).

[0067] 7200-H: DCPD-type novolac epoxy resin (tradename of DIC).

[0068] HPC-8000-65T: active ester resin (tradename of Japan DIC).

[0069] CE01PS: bisphenol A cyanate ester (tradename of Yangzhou Techia).

[0070] 525: silica filler (tradename of Sibelco).

[0071] BYK-W903: filler dispersant (tradename of BYK).

[0072] DMAP: curing accelerator, 4-dimethylaminopyridine (tradename of Koei Chemical).

[0073] Zinc isocaprylate: curing accelerator (tradename of Alfa Aesar).

TABLE-US-00001 TABLE 1 Name Materials Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Epoxy resin NC-3000H 100 100 100 100 100 100 100 7200-H 100 Active ester resin HPC-8000-65T 37 37 24 11 24 20 15 37 Cyanate ester CE01PS 18 30 Reactive B1 40 53 66 43 33 phosphorous- B2 40 53 40 containing flame retardant Filler 525 76 76 76 76 76 78 80 Dispersant BYK-W903 0.76 0.76 0.76 0.76 0.76 0.78 0.8 Accelerator DMAP An An An An An An An An appropriate appropriate appropriate appropriate appropriate appropriate appropriate appropriate amount amount amount amount amount amount amount amount Zinc An An isocaprylate appropriate appropriate amount amount CCL properties Inter-laminar 0.45-0.60 0.60-0.80 0.62-0.82 0.65-0.85 0.70-0.90 0.50-0.70 0.45-0.65 0.55-0.70 adhesive force Coefficient of 1.90% 2.10% 2.00% 2.00% 2.10% 1.80% 1.80% 2.10% thermal expansion PCT (6 h) >5 min >5 min >5 min >5 min >5 min >5 min >5 min >5 min Flammability V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0

TABLE-US-00002 TABLE 2 Comparative Comparative Comparative Comparative Comparative Name Materials Example 1 Example 2 Example 3 Example 4 Example 5 Epoxy resin NC-3000H 100 100 100 7200-H 100 100 Active ester resin HPC-8000-65T 37 37 24 Linear novolac resin 2812 37 37 Reactive B1 40 phosphorous-containing B2 40 flame retardant B3 53 Phosphorous-containing 92741 66 66 novolac resin Filler 525 76 76 76 76 76 Filler dispersant BYK-W903 0.76 0.76 0.76 0.76 0.76 Accelerator DMAP An An An An An appropriate appropriate appropriate appropriate appropriate amount amount amount amount amount CCL properties Inter-laminar 0.20-0.30 0.25-0.35 0.26-0.36 0.27-0.37 0.20-0.30 adhesive force Coefficient of 2.70% 2.80% 2.50% 2.40% 2.80% thermal expansion PCT (6 h) 3 s 3 s 3 s 3 s 3 s Flammability V-0 V-0 V-0 V-0 V-0

[0074] The methods for testing the above characteristics were as follows:

[0075] (1) Inter-laminar adhesive force (vertical method): the inter-laminar adhesive force of the composition was tested by the vertical stretching method specified in SYL Enterprise Standard Q/GDSY6052-2016.

[0076] (2) Coefficient of thermal expansion: on the basis of the thermomechanical analysis (TMA), the coefficient of thermal expansion was measured according to the TMA method specified in IPC-TM-6502.4.24.

[0077] (3) PCT (6 h): After the copper foil on the surface of the copper-clad laminate was etched, the substrate was evaluated. The substrate was placed in a pressure cooker and treated under conditions of 120 C. and 105 kPa for 6 hours, and then it was immersed in a solder machine at 288 C. When the substrate delaminated, the corresponding time was recorded. If there was no bubbles or delamination after the substrate was kept in the solder machine for more than 5 minutes, the evaluation could be brought to an end.

[0078] (4) Flammability: The flammability was tested according to the stipulation in UL94 method.

[0079] It can be seen from the data of physical properties in Table 1 and Table 2 that:

[0080] (1) The laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin 7200-H, active ester resin HPC-8000-65T and reactive phosphorous-containing flame retardant B1 in Example 1 has an inter-laminar adhesive force of 0.45 to 0.60, a coefficient of thermal expansion of 1.90%, and a heat-humidity resistance of more than 5 minutes upon the determination of PCT (6 h), and it can achieve the halogen-free flame retardant purpose, while the laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin, active ester resin HPC-8000-65T and phosphorous-containing novolac resin 92741 in Comparative Examples 1 and 2 has an inter-laminar adhesive force of 0.20 to 0.30, which is much lower than that of Example 1, a coefficient of thermal expansion of 2.70%, which is much higher than that of Example 1, and a heat-humidity resistance of 3 seconds upon the determination of PCT (6 h), which is much lower than that of Example 1.

[0081] The above results show that the laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin, active ester resin and reactive phosphorous-containing flame retardant in Example 1 has a higher inter-laminar adhesive force, a lower coefficient of thermal expansion, and a more superior heat-humidity resistance, and it can achieve the halogen-free flame retardant purpose, when compared with the laminate made from the halogen-free epoxy resin composition s made by replacing reactive phosphorous-containing flame retardant with phosphorous-containing novolac resin in Comparative Examples 1 and 2.

[0082] (2) The laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin NC-3000H, active ester resin HPC-8000-65T and reactive phosphorous-containing flame retardant B1 in Example 2 has an inter-laminar adhesive force of 0.60 to 0.80, a coefficient of thermal expansion of 2.10%, and a heat-humidity resistance of more than 5 minutes, and it can achieve the halogen-free flame retardancy, while the laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin NC-3000H, linear novolac resin 2812 and reactive phosphorous-containing flame retardant B1 in Comparative Example 3 has an inter-laminar adhesive force of 0.26 to 0.36, which is much lower than that of Example 2, a coefficient of thermal expansion of 2.80%, which is much higher than that of Example 2, and a heat-humidity resistance of 3 seconds upon the determination of PCT (6 h), which is much lower than that of Example 2.

[0083] The laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin 7200-H, active ester HPC-8000-65T and reactive phosphorous-containing flame retardant B2 in Example 1 has an inter-laminar adhesive force of 0.45 to 0.60, a coefficient of thermal expansion of 1.90%, and a heat-humidity resistance of more than 5 minutes, and it can achieve the halogen-free flame retardant purpose, while the laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin 7200-H, linear novolac resin 2812 and reactive phosphorous-containing flame retardant B2 in Comparative Example 4 has an inter-laminar adhesive force of 0.27 to 0.37, which is much lower than that of Example 1, a coefficient of thermal expansion of 2.40%, which is much higher than that of Example 1, and a heat-humidity resistance of 3 seconds upon the determination of PCT (6 h), which is much lower than that of Example 1.

[0084] The above results show that the laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin, active ester resin and reactive phosphorous-containing flame retardant in Examples 1 and 2 has a higher inter-laminar adhesive force, a lower coefficient of thermal expansion, and a more superior heat-humidity resistance, and it can achieve the halogen-free flame retardant purpose, when compared with the laminate made from the halogen-free epoxy resin composition made by replacing active ester resin with linear novolac resin in Comparative Examples 3-4.

[0085] (3) The laminate made from the halogen-free epoxy resin composition composed of epoxy resin NC-3000H, active ester resin HPC-8000-65T and reactive phosphorous-containing flame retardant B1 in Example 3 has an inter-laminar adhesive force of 0.60 to 0.82, a coefficient of thermal expansion of 2.00%, and a heat-humidity resistance of more than 5 minutes, and it can achieve the halogen-free flame retardant purpose. The laminate made from the halogen-free epoxy resin composition composed of epoxy resin NC-3000H, active ester resin HPC-8000-65T, and reactive phosphorous-containing flame retardant B2 in Example 5 has an inter-laminar adhesive force of 0.70 to 0.90, a coefficient of thermal expansion of 2.10%, and a heat-humidity resistance of more than 5 minutes, and it can achieve the halogen-free flame retardant purpose. However, the laminate made from the halogen-free epoxy resin composition composed of epoxy resin NC-3000H, active ester resin HPC-8000-65T and reactive phosphorous-containing flame retardant B3 in Comparative Example 5 has an inter-laminar adhesive force of 0.20 to 0.30, which is much lower than that of Examples 3 and 5, a coefficient of thermal expansion of 2.80%, which is much higher than that of Examples 3 and 5, and a heat-humidity resistance of only 3 seconds, which is much lower than that of Examples 3 and 5.

[0086] The above results shows that the laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin, active ester resin and reactive phosphorous-containing flame retardant B1 or B2 in Examples 3 or 5 has a higher inter-laminar adhesive force, a lower coefficient of thermal expansion, and a more superior heat-humidity resistance, and it can achieve the halogen-free flame retardant purpose, when compared with the laminate made from the halogen-free epoxy resin composition made by replacing reactive phosphorous-containing flame retardant B1 or B2 according to the present disclosure with B3 in CN105906785A in Comparative Example 5.

[0087] (4) It can been seen from Examples 1-8 that in the halogen-free epoxy resin compositions composed of halogen-free epoxy resin, active ester resin and reactive phosphorous-containing flame retardant according to the present disclosure, the three essential components coordinate with each other and show synergistic promoting effect. The prepreg and the laminate made from the halogen-free epoxy resin composition has the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, the inter-laminar adhesive force of which can reach 0.45 or more, the coefficient of thermal expansion is 2.10% or less, and the heat-humidity resistance can reach up to 5 minutes or more, furthermore, the halogen-free flame retardant purpose can be achieved.

[0088] In conclusion, compared with the general laminate, the prepreg, the laminate and the metal-clad laminate made from the halogen-free epoxy resin composition composed of halogen-free epoxy resin, active ester resin and reactive phosphorous-containing flame retardant according to the present disclosure have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, furthermore, the halogen-free flame retardant can be achieved.

[0089] Applicant has stated that although the detailed process equipment and process flow of the present disclosure have been described by the above embodiments in the present disclosure, the present disclosure is not limited thereto, that is to say, it is not meant that the present disclosure has to be implemented depending on the above detailed process equipment and process flow. It will be apparent to those skilled in the art that any improvements made to the present disclosure, equivalent replacements and addition of adjuvant ingredients to the raw materials of the products of the present disclosure, and selections of the specific implementations, etc., all fall within the protection scope and the disclosure scope of the present disclosure.