A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.

Provided are a sheet molding compound having good handleability and good reinforcing fiber filling properties; and a molded article having good mechanical properties and good heat resistance.

The sheet molding compound comprises a thermosetting resin composition and reinforcing fiber bundles, in which the thermosetting resin composition comprises an epoxy resin component (E) comprising a reaction product (1) of the following component (A) and the following component (B), and the following component (C). The molded article is an article obtained by press-molding the sheet molding compound.

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.

The thermosetting resin composition is used for a sheet-form insulating varnish to be disposed in a gap between insulation target members, and contains: a thermosetting resin (A) that is in solid form at 25 C.; a thermosetting resin (B) that is in liquid form at 25 C.; a latent curing agent that is unreactive at 60 C. or lower; and an inorganic filler having a maximum particle diameter smaller than a dimension of the gap and having an average particle diameter smaller than 0.5 times the dimension of the gap. 30 parts by mass to 70 parts by mass of the thermosetting resin (A) is contained per a total of 100 parts by mass of the thermosetting resin (A) and the thermosetting resin (B). A volume ratio of the inorganic filler to an entirety of the composition is not higher than 50%.

This invention relates to a resin composition. The resin composition comprises a first polyfunctional epoxy component (i) comprising an epoxy resin based on a alkylol alkane triglycidyl ether monomer, and a second component, (ii) comprising an epoxy resin. The composition further comprise a third component, (iii) comprising a hydrazide based curative in combination with either (a) a urone based curative or (b) an imidazole based curative or both.

Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness. Compositions produced from the formulations have excellent processing and mechanical properties, and may also have good surface finishes.

With the use of a photoalignment film, the present invention provides a liquid crystal display device capable of maintaining a favorable voltage holding ratio and reducing or preventing image sticking, stains, and a decrease in contrast ratio for a long time not only in a room-temperature environment but also in a high-temperature environment; and a method for producing such a liquid crystal display device. The liquid crystal display device of the present invention includes paired substrates; a liquid crystal layer disposed between the substrates; a photoalignment film disposed between at least one of the substrates and the liquid crystal layer; and a polymer layer disposed between the photoalignment film and the liquid crystal layer, wherein the polymer layer has a structure derived from a specific epoxy-based monomer and a structure derived from a specific curing agent.

This invention relates to fusion bonded epoxy rebar powder coating compositions of enough latency overtime, which cure in seconds upon residual heat up to 239.0 C., exhibiting low temperature flexibility to achieve crack-free rebar bending at 45 C. and a glossy finish without yellowing or discoloration. This invention further relates to rebar powder coatings compounded using suitable dihydrazide amines as the curing agent, in combination with an executive resin blend including a compatible toughening epoxy, and a synergic catalyst package to meet the intended application challenges.

A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.