A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.

A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130 C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85 C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

This invention relates to fusion bonded epoxy rebar powder coating compositions of enough latency overtime, which cure in seconds upon residual heat up to 239.0 C., exhibiting low temperature flexibility to achieve crack-free rebar bending at 45 C. and a glossy finish without yellowing or discoloration. This invention further relates to rebar powder coatings compounded using suitable dihydrazide amines as the curing agent, in combination with an executive resin blend including a compatible toughening epoxy, and a synergic catalyst package to meet the intended application challenges.

Heat-curing epoxy resin compositions containing a curing agent in the form of a mixture of aromatic dicarboxylic dihydrazide with a dihydrazide chosen from the group consisting of glutaric dihydrazide, adipic dihydrazide, pimelic dihydrazide, 8,12-eicosadienedioic acid-1,20-dihydrazide and 4-isopropyl-2,5-dioxoimidazolidine-1,3-di(propionohydrazide). The epoxy resin compositions are particularly suitable for automotive body-in-white bonding, where after induction pre-curing without additional metal joining techniques the pre-cured adhesives are cured again in a further step at temperatures of around 180? C.

A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.

A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.

A first epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-1] at least a first hardener and [B-2] at least a second hardener different from the first hardener, and [C] at least one accelerator, wherein the epoxy resin composition satisfies 5.0>|T.sub.1?T.sub.2|, where [A], [B], [C], T.sub.1 and T.sub.2 are as defined. A second epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-1] at least one amine compound and [B-2] at least one organic acid hydrazide compound, and [C] at least one accelerator comprising [C-1] at least one organophosphorus compound, where [A], [B] and [C-1] are as defined. A prepreg comprising reinforcing fiber bundles impregnated with the first epoxy resin or the second epoxy resin is also described as well as a fiber-reinforced composite material.

A epoxy resin composition includes a given epoxy resin [A], an aromatic amine compound [B], an organic acid hydrazide compound [C] having a structural formula represented by general formula (I) or (II) (X is a structure selected from among monocyclic and polycyclic aromatic ring structures, polycyclic aromatic ring structures, and aromatic heterocyclic structures and optionally has, as a substituent, any of C.sub.4 or lower alkyl groups, a hydroxy group, and an amino group), and a thermoplastic resin [D], wherein the amount of the constituent element [C] is 1-25 parts by mass per 100 parts by mass of the constituent element [A], the epoxy resin composition, after having been held at 80 C. for 2 hours, having a viscosity which is up to 2.0 times the initial viscosity at 80 C. ##STR00001##

The thermosetting resin composition is used for a sheet-form insulating varnish to be disposed in a gap between insulation target members, and contains: a thermosetting resin (A) that is in solid form at 25? C.; a thermosetting resin (B) that is in liquid form at 25? C.; a latent curing agent that is unreactive at 60? C. or lower; and an inorganic filler having a maximum particle diameter smaller than a dimension of the gap and having an average particle diameter smaller than 0.5 times the dimension of the gap. 30 parts by mass to 70 parts by mass of the thermosetting resin (A) is contained per a total of 100 parts by mass of the thermosetting resin (A) and the thermosetting resin (B). A volume ratio of the inorganic filler to an entirety of the composition is not higher than 50%.