Provided is a thermoplastic resin composition suitable for laser welding which has a laser transparency, a good laser weldability, mechanical properties, a high hydrolysis resistance, a laser-welded composite molded article such as a composite article obtained by laser-welding molded resin parts, and a method of laser welding such molded resin articles. The thermoplastic resin composition contains (A) polybutylene terephthalate, (B) polycarbonate, (C) reinforcing fiber, (D) epoxy compound, (E) carbodiimide compound, and (F) phosphorus-based stabilizer.

A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance.

The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature.

The thermosetting resin composition comprises: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:

##STR00001##

(wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or
(b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):

##STR00002##

(wherein Ar.sup.1 to Ar.sup.4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).

A polycarbodiimide compound represented by the following general formula (1): ##STR00001## wherein R.sup.1 and R.sup.3 are defined in the specification; R.sup.2 comprises a group represented by formula (i) or (ii) as defined in the specification; the proportion of the groups represented by the formula (i) relative to all the R.sup.2 groups in the polycarbodiimide compound is 30 to 70 mol %, and the proportion of the groups represented by the formula (ii) relative to all the R.sup.2 groups in the polycarbodiimide compound is 30 to 70 mol %; X.sup.1 and X.sup.2 each represent a group formed by the reaction of the organic compound and isocyanate, and X.sup.1 and X.sup.2 may be the same as or different from each other; and n represents an integer of 2 to 50.

This invention relates to a hardener composition for an epoxy resin based two-pack coating formulation wherein the hardener composition comprises moieties having at least one structural element of formula >N-D1-NH2, and moieties having at least one structural element of formula >N-D2-NH—C(O)-Q, wherein D1 is a bivalent group, D2 is a bivalent group, and Q is a univalent group, to epoxy resin based two-pack coating formulations comprising at least one epoxy resin which is a polymer containing, on average, at least two epoxide groups per molecule, and the hardener composition, and at least one of diglycerides which are esters of glycerol with two molecules of fatty acid, monoglycerides which are esters of glycerol with one molecule of fatty acid, or glycerol, or the reaction products of at least one of diglycerides or monoglycerides or glycerol with organic compounds having at least one reactive group selected from the group consisting of acylesters, acylanhydrides, isocyanates, epoxides, cyclocarbonates, and aziridines, and to the use of these epoxy resin based two-pack coating formulations as protective coatings on metallic and mineral substrates.

Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.

A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.

A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 μm to 50 μm, and a radical polymerization initiator.

Provided is an organic-inorganic composite resin composition for coating the surface of a zinc-plated steel sheet, comprising 5-25 wt % of a polymer resin, 4-20 wt % of a silane compound, 3-10 wt % of a curing agent and 0.1-2 wt % of ferrocene compound on the basis of the total weight of the composition.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.