An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

A self-healing vacuum insulation panel and a method of manufacture are provided. The vacuum insulation panel includes a self-healing, multi-layer barrier film including a separator between a curing agent and a curable resin. Upon damage to the separator, the curing agent penetrates the separator due to a pressure differential across the barrier film and reacts with the curable resin to seal any cuts or punctures. The curing agent and the curable resin can be selected to have long term stability and a short reaction time with no need for external stimuli. As a result, the multi-layer barrier film can retain the internal vacuum and maintain a desirably low thermal conductivity using low-cost, commercially available epoxies and curing agents.

The present invention provides high temperature performing, conductive thermosetting resin compositions.

In a method for manufacturing lamination stacks of controlled height in a tool, starting material is provided as continuous strip delivered from a coil or as an individual sheet. Laminations are punched from the starting material in several punching steps to a required contour of the laminations. A heat-curing adhesive is applied onto the laminations prior to performing a last punching step. The laminations are combined to a lamination stack. The laminations of the lamination stack are partially or completely heated in a lamination storage. The adhesive is liquefied by heating the lamination stack to build up adhesion and then solidified. Curing the adhesive at the liquefying temperature or solidifying the adhesive in the tool by cooling and subsequently heating the adhesive to a temperature below the liquefying temperature is possible so that the adhesive does not melt but undergoes further curing resulting in higher temperature stability.

Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.

In a method for manufacturing lamination stacks of controlled height in a tool, starting, material is provided as continuous strip delivered from a coil or as an individual sheet. Laminations are punched from the starting material in several punching steps to a required contour of the laminations. A heat-curing adhesive is applied onto the laminations prior to performing a last punching step. The laminations are combined to a lamination stack. The laminations of the lamination stack are partially or completely heated in a lamination storage. The adhesive is liquefied by heating the lamination stack to build up adhesion and then solidified. Curing the adhesive at the liquefying temperature or solidifying the adhesive in the tool by cooling and subsequently heating the adhesive to a temperature below the liquefying temperature is possible so that the adhesive does not melt but undergoes further curing resulting in higher temperature stability.