A method is disclosed for preventing hardener compounds to be formed from hardener precursors in a sealed and pressurized aerosol can. This includes a paint forming dispersion containing after sealing the can a liquefied propellant, epoxy or/and polyurethane resins amount W1, hardener precursor of the epoxy or/and polyurethane resins amount W3, where the epoxy or urethane hardener precursors are selected from a group including an imine, an enamine, a Mannich base, a Schiff's base, an oxazolidine, an aldimine and mixtures thereof, free water of amount W1 in a range of 1-10000 ppm, and brought into the can alongside with the other paint dispersion forming chemicals before sealing the can. A catalytic compound prevents formation of the epoxy or/and polyurethane hardener amines from the epoxy or/and polyurethane hardener precursors: ##STR00001##

An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.

A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar.sup.1 is a substituted or unsubstituted aromatic ring group, each R.sup.1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R.sup.2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar.sup.1 or as R.sup.1).

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

A composition is provided comprising: a) a curable epoxy resin; and b) 0.01-30% by weight of a polycarbodiimide according to Formula I:
R{NCNR}.sub.nNCNR(I)
wherein n is an integer between 0 and 100, and wherein each R is independently selected from aromatic and aliphatic groups which contain between 1 and 24 carbons and which are optionally substituted, typically comprising 0.1-20% by weight of the polycarbodiimide. In some embodiments the present disclosure provides sheet materials made of such cured, uncured or partially cured materials. In some embodiments these compositions may be useful in making surfacing films for composite parts and may demonstrate good paint stripper resistance and microcrack resistance.