A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure and/or (b) a polyvalent amine-based curing agent (component b).

A resin composition comprising at least an organic resin, wherein physical property parameters specified by a storage modulus at a predetermined temperature and a glass transition temperature satisfy their respective predetermined ranges.

This invention relates to a hardener composition for an epoxy resin based two-pack coating formulation wherein the hardener composition comprises moieties having at least one structural element of formula >N-D1-NH2, and moieties having at least one structural element of formula >N-D2-NHC(O)-Q, wherein D1 is a bivalent group, D2 is a bivalent group, and Q is a univalent group, to epoxy resin based two-pack coating formulations comprising at least one epoxy resin which is a polymer containing, on average, at least two epoxide groups per molecule, and the hardener composition, and at least one of diglycerides which are esters of glycerol with two molecules of fatty acid, monoglycerides which are esters of glycerol with one molecule of fatty acid, or glycerol, or the reaction products of at least one of diglycerides or monoglycerides or glycerol with organic compounds having at least one reactive group selected from the group consisting of acylesters, acylanhydrides, isocyanates, epoxides, cyclocarbonates, and aziridines, and to the use of these epoxy resin based two-pack coating formulations as protective coatings on metallic and mineral substrates.

A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 m to 50 m, and a radical polymerization initiator.

A self-healing vacuum insulation panel and a method of manufacture are provided. The vacuum insulation panel includes a self-healing, multi-layer barrier film including a separator between a curing agent and a curable resin. Upon damage to the separator, the curing agent penetrates the separator due to a pressure differential across the barrier film and reacts with the curable resin to seal any cuts or punctures. The curing agent and the curable resin can be selected to have long term stability and a short reaction time with no need for external stimuli. As a result, the multi-layer barrier film can retain the internal vacuum and maintain a desirably low thermal conductivity using low-cost, commercially available epoxies and curing agents.

A method is disclosed for preventing hardener compounds to be formed from hardener precursors in a sealed and pressurized aerosol can. This includes a paint forming dispersion containing after sealing the can a liquefied propellant, epoxy or/and polyurethane resins amount W1, hardener precursor of the epoxy or/and polyurethane resins amount W3, where the epoxy or urethane hardener precursors are selected from a group including an imine, an enamine, a Mannich base, a Schiff's base, an oxazolidine, an aldimine and mixtures thereof, free water of amount W1 in a range of 1-10000 ppm, and brought into the can alongside with the other paint dispersion forming chemicals before sealing the can. A catalytic compound prevents formation of the epoxy or/and polyurethane hardener amines from the epoxy or/and polyurethane hardener precursors:

##STR00001##

A polycarbodiimide compound represented by the following general formula (1):

##STR00001##

wherein R.sup.1 and R.sup.3 each represent a residue of an organic compound having one isocyanate-reactive functional group but excluding the isocyanate-reactive functional group, and R.sup.1 and R.sup.3 may be the same as or different from each other; R.sup.2 comprises a group represented by the following formula (i), which is a divalent residue of 2,4-diphenylmethane diisocyanate having isocyanate groups removed therefrom, and a group represented by the following formula (ii), which is a divalent residue of 4,4-diphenylmethane diisocyanate having isocyanate groups removed therefrom; the proportion of the groups represented by the formula (i) relative to all the R.sup.2 groups in the polycarbodiimide compound is 30 to 70 mol %, and the proportion of the groups represented by the formula (ii) relative to all the R.sup.2 groups in the polycarbodiimide compound is 30 to 70 mol %; X.sup.1 and X.sup.2 each represent a group formed by the reaction of the organic compound and isocyanate, and X.sup.1 and X.sup.2 may be the same as or different from each other; and n represents an integer of 2 to 50.

##STR00002##

Provided is a one-pack type adhesive which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a polycarbodiimide compound, and wherein: the curing agent (B) contains at least one amine-based curing agent; the curing accelerator (C) contains at least one capsule type curing accelerator; the inorganic filler (D) contains at least one flake-like inorganic filler; and the content of the inorganic filler (D) is 10-200 parts by mass relative to 100 parts by mass of the epoxy resin (A).

A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130 C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85 C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.