The present invention provides aqueous compositions for making damage tolerant coatings comprising a blend of (i) from 2 to 30 wt. %, based on the total weight of solids in the composition, of an acid or anhydride functionalized polyolefin dispersion having an average particle size of from 0.2 to 5 microns, and (ii) a film forming dispersion of one or more epoxy resins chosen from epoxy resins having an epoxy equivalent weight (EEW) of from 150 to 4,000 having an average particle size of from 0.2 to 1.0 microns, wherein the polyolefin dispersion is stabilized with from 2 to 8 wt. %, based on the total weight of solids in the composition, one or more anionic surfactants, such as a sulfate containing surfactant, and, further wherein, the compositions have a pH of from 3 to 8.

An object of the present invention is to provide an adhesion improver for a carbon fiber-reinforced polyolefin-based resin composition that provides improved mechanical characteristics such as bending strength and bending elastic modulus. The adhesion improver is used for a carbon fiber-reinforced resin composition including carbon fibers and a polyolefin-based resin. The adhesion improver includes an acid-modified polyolefin-based resin unit and an epoxy resin unit. The acid-modified polyolefin-based resin unit and the epoxy resin unit are linked via an ester structure, and the epoxy resin unit includes a secondary hydroxy group.

The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):

##STR00001##

wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15 C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

In some aspects, the disclosure relates to thermoset polymeric compositions consisting of functional bio-based epoxies and/or their derivatives (e.g. epoxidized vegetable oil(s)), along with carboxyl functional acrylics and/or polyesters. When cured, example compositions yield high performance products suitable for composite, coating, adhesive, sealant, and/or elastomer applications. When used in stone composite formulations with suitable fillers like quartz and titanium dioxide, example products have high hardness, very low water absorption, and high mechanical strength along with stain, chemical, and heat resistance. When used in coating formulations, example cured films have excellent adhesion, high gloss, clarity, toughness, low water absorption, solvent and chemical resistance, flexibility, and impact resistance without compromising hardness. Coating formulation properties may also include exterior durability. The composition properties may be selectively modified to hard, soft, tough, or elastomeric by selecting the appropriate stoichiometry and type of functional resin to react with epoxy(ies)/derivative(s).

The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.

The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.

The invention relates to an adhesive composition having an added component of rubber-epoxy such as XNBR-epoxy adducts. It was found that the new adhesive composition significantly reduces meander formation in the making of automotive parts.

The present invention relates to a thermoset resin composition and prepreg made of the same and laminated board. The thermoset resin composition comprises the following constituents in parts by weight: 50-150 parts of cyanate; 30-120 parts of epoxy resin; 20-70 parts of allyl benzene maleic anhydride; 20-100 parts of polyphenyl ether; 30-100 parts of halogen-free flame retardant; 0.05 to 5 parts of curing accelerator; 50-200 parts of filler. The prepreg and the laminated board made of the thermoset resin composition have comprehensive performance such as low dielectric constant, low dielectric loss, superior flame retardancy, thermal resistance and wet resistance etc., and is suitable for use in a halogen-free high-frequency multilayer circuit board.

An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same:

##STR00001##

wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.