A thermosetting resin composition contains a thermosetting resin, an activator, and a thixotropy-imparting agent. The thermosetting resin contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.

Compositions and curing agents comprising a benzylated Mannich base composition. The benzylated Mannich base composition includes a reaction product of (a) a substituted phenolic compound having at least one substituent of formula (I): ##STR00001##
wherein R.sub.1 is each independently a linear or branched alkyl group having 1 to 4 carbon atoms, and R.sub.2 is hydrogen, methyl, ethyl or phenyl, with (b) a benzylated polyalkylene polyamine (II): ##STR00002##
wherein R.sub.A is substituted or unsubstituted benzyl; R.sub.B is each independently R.sub.A, or a hydrogen atom, or a group selected from C.sub.1-C.sub.16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; X, Y, and Z are independently selected from C.sub.2-C.sub.10 alkylene, and cycloalkylene groups; y is an integer from 0 to 7, and z is an integer from 0 to 4; and, optionally, (c) a multifunctional amine. Amine-epoxy compositions and articles produced from these compositions are also disclosed.

Disclosed are a phosphaphenanthrene-structure reactive flame retardant and an application thereof. The preparation method comprises: enabling 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), p-hydroxy benzaldehyde (4-HBA), and 5-aminomethyl-1,3-diphenyl-1,3,5-diphosphonitryl heterocycles to react under a certain condition to obtain the reactive flame retardant with a benzene ring rigid structure containing polyhydroxy. Compared with an ordinary flame retardant, the phosphaphenanthrene-structure reactive flame retardant has the characteristics that polyfunctionality is achieved, the molecular structure is stable, the hydrolysis resistance is better, and less migration in epoxy resin, moreover, the flame retardant property of the epoxy resin can be remarkably improved.

There are provided a curable resin composition capable of having a rapid curing property and forming a cured product with an excellent property such as a high heat resistance, a cured product obtained from the curable resin composition, and a method for hardening the curable resin composition. There is further provided a semiconductor device using the curable resin composition as a sealant. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a phosphorus-containing curing accelerator, and optionally further contains (E) an inorganic filler. The semiconductor device contains a cured product obtained by hardening the curable resin composition containing the components (A) to (E), and further contains a semiconductor element placed in the cured product.

The present invention relates to a polymeric Mannich base useful as an epoxy curative and/or accelerator, which has an improved safety profile due to the avoidance of the use of phenol in its preparation. More specifically, the present invention provides a method for forming a polymeric Mannich base, as well polymeric Mannich bases preparable by the method, for use as an epoxy resin curative and/or accelerator, said method comprising: i) providing: a) a polymer comprising aromatic terminal groups linked by a hydrocarbyl polymeric backbone, wherein each of the aromatic terminal groups comprises a ring substituted with at least one activating group and at least one unsubstituted ring atom, wherein the one or more activating groups is capable of activating the aromatic terminal group to undergo electrophilic aromatic 15 substitution at the at least one unsubstituted ring atom; wherein the aromatic terminal groups are bonded to the hydrocarbyl polymeric backbone through an ether, ester, amine, amide, thioether, or thioester group; b) a primary or secondary monoamine and/or a polyamine comprising primary and/or secondary amino groups, and c) an aldehyde; and ii) performing a Mannich reaction using components a) to c), wherein each aromatic terminal group of the polymer is converted to a Mannich base.

A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other: ##STR00001##
Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R.sup.1 and R.sup.2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R.sup.3 represents a hydroxyl group, a methoxy group, or a halogen atom.

Disclosed are a phosphaphenanthrene-structure reactive flame retardant and an application thereof. The preparation method comprises: enabling 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), p-hydroxy benzaldehyde (4-HBA), and 5-aminomethyl-1,3-diphenyl-1,3,5-diphosphonitryl heterocycles to react under a certain condition to obtain the reactive flame retardant with a benzene ring rigid structure containing polyhydroxy. Compared with an ordinary flame retardant, the phosphaphenanthrene-structure reactive flame retardant has the characteristics that polyfunctionality is achieved, the molecular structure is stable, the hydrolysis resistance is better, and less migration in epoxy resin, moreover, the flame retardant property of the epoxy resin can be remarkably improved.

The present invention relates to a new structural class of phenalkamine, phenalkamine curing agent compositions, methods of making such phenalkamine, and methods of making such compositions. The phenalkamine curing agent compositions of the present invention can be prepared by reacting cardanol with an aldehyde compound and a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin.

A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.

A two-component curable resin composition forms a cured product having high elongation and high strength while maintaining adhesive force to metal. A two-component curable resin composition includes the following agent A and agent B. Agent A is a composition containing component (a) and component (b). Component (a) is (a-1) a hydrogenated epoxy resin and (a-2) a bisphenol type epoxy resin. Component (b) is a curing catalyst of component (c). Agent B is a composition containing component (c) and component (d). Component (c) is an organic polymer having two or more hydrolyzable silyl groups. Component (d) is a curing agent for component (a).