C08G63/547

Low melting and low viscosity thermoset matrix resins from the Z configuration of polyhydroxy stilbenes

The invention generally relates to novel poly-substituted cis stilbenes, their synthesis, their purification, and their use in thermoset resins. These novel cis stilbenes give rise to thermoset resins with greatly improved processing characteristics such as lower melting temperature and lower viscosity; resulting in polymers and composites having greatly improved thermal stability.

Resin formulation and use thereof as a surface marker

A surface marker resin formulation is provided that includes a linear aromatic polyester or a co-polymer thereof present in an amount of 10 to 45 total weight percent. The resin is dissolved or dispersed in a solvent. A colorant package is also dissolved or dispersed in the solvent. Upon drying of the solvent a mark is provided on a surface that can alert a user as to relative movement between articles defining the surface. A process of marking a surface includes two articles being brought into a pre-selected alignment to define a surface. A continuous bead is applied to the surface. The solvent evaporates to a state of dry-to-touch in a time of between 1 and 30 minutes to mark the surface.

Resin formulation and use thereof as a surface marker

A surface marker resin formulation is provided that includes a linear aromatic polyester or a co-polymer thereof present in an amount of 10 to 45 total weight percent. The resin is dissolved or dispersed in a solvent. A colorant package is also dissolved or dispersed in the solvent. Upon drying of the solvent a mark is provided on a surface that can alert a user as to relative movement between articles defining the surface. A process of marking a surface includes two articles being brought into a pre-selected alignment to define a surface. A continuous bead is applied to the surface. The solvent evaporates to a state of dry-to-touch in a time of between 1 and 30 minutes to mark the surface.

CURABLE COMPOSITION AND CURED PRODUCT THEREOF
20210009804 · 2021-01-14 · ·

A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

CURABLE COMPOSITION AND CURED PRODUCT THEREOF
20210009804 · 2021-01-14 · ·

A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

A COMPOSITION COMPRISING METHYLENE MALONATE MONOMER AND POLYMER, THE PREPARATION THEREOF AND USE OF THE SAME IN FLOORING APPLICATIONS
20200385607 · 2020-12-10 ·

The present invention relates to a composition comprising methylene malonate monomer and polymer in construction field. Particularly, the invention relates to a two-component composition comprising at least one methylene malonate monomer (A), at least one polymer (B) and at least one acidic stabilizer (C), and component II comprising at least one alkali accelerator, to the preparation thereof, and to the use of the composition as a coating material, particularly as a flooring coat.

Bisphenol alternative derived from renewable substituted phenolics and their industrial application

A compound is provided according to structure 4, (4) wherein n has a value from 0 to 48 and Z is hydroxyl or a benzene ring bearing substituents R.sub.11-R.sub.15, wherein R.sub.1-R.sub.15 are each individually selected from the group consisting of H, allyl, alkyl, alkoxy, phenyl, phenoxy, halide, hydroxyl, glycidyl, (meth)acryloyl, 3-(meth)acryloyl-2-hydroxy-1-propoxy, 2,3-epoxypropyl, maleate, and structure (a) wherein at least one of R.sub.1-R.sub.5, at least one of R.sub.6-R.sub.10, and at least one of R.sub.11-R.sub.15 is hydroxyl or an ether or ester derived from it and one of the R.sub.6-R.sub.10 groups is replaced by a direct bond to the CXY group. ##STR00001##

Bisphenol alternative derived from renewable substituted phenolics and their industrial application

A compound is provided according to structure 4, (4) wherein n has a value from 0 to 48 and Z is hydroxyl or a benzene ring bearing substituents R.sub.11-R.sub.15, wherein R.sub.1-R.sub.15 are each individually selected from the group consisting of H, allyl, alkyl, alkoxy, phenyl, phenoxy, halide, hydroxyl, glycidyl, (meth)acryloyl, 3-(meth)acryloyl-2-hydroxy-1-propoxy, 2,3-epoxypropyl, maleate, and structure (a) wherein at least one of R.sub.1-R.sub.5, at least one of R.sub.6-R.sub.10, and at least one of R.sub.11-R.sub.15 is hydroxyl or an ether or ester derived from it and one of the R.sub.6-R.sub.10 groups is replaced by a direct bond to the CXY group. ##STR00001##

Low melting and low viscosity thermoset matrix resins from the Z configuration of polyhydroxy stilbenes

The invention generally relates to novel poly-substituted cis stilbenes, their synthesis, their purification, and their use in thermoset resins. These novel cis stilbenes give rise to thermoset resins with greatly improved processing characteristics such as lower melting temperature and lower viscosity; resulting in polymers and composites having greatly improved thermal stability.

Method for producing binder resin
10719024 · 2020-07-21 · ·

An embodiment of the present invention relates to a method for producing a binder resin, from which a toner having excellent low-temperature fusing property, roller release properties, and pulverization properties, is obtained, a binder resin, and a toner for development of electrostatic images including the binder resin. An embodiment of the present invention relates to a method for producing a binder resin including the following steps (1) and (2): step (1): mixing an aromatic alcohol including an alkylene oxide adduct of bisphenol A and fumaric acid; and step (2): further adding a carboxylic acid to the mixture obtained in the step (1) and mixing until a softening point of the binder resin in the system falls within the predetermined range, wherein in the molecular weight distribution measured by gel permeation chromatography, the binder resin includes 40% or more of components having a molecular weight of 10,000 or more and has a peak top of molecular weight distribution within a range of 7,500 or more and 10,000 or less.