A cationic curing agent includes porous particles and a compound represented by General Formula (1), where the compound is held in the porous particles.

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In the General Formula (1), R.sup.1 is an alkyl group having 1 to 18 carbon atoms or a phenyl group, where the alkyl group may be branched and the alkyl group and the phenyl group may each further have a substituent. R.sup.2 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms where the alkyl group may be branched, a halogenoalkyl group, an alkoxy group, or a phenoxy group; where the alkyl group, the halogenoalkyl group, the alkoxy group, or the phenoxy group may further have a substituent. R.sup.1 and R.sup.2 may be identical to or different from each other.

Radiation curable compositions for additive fabrication are described and claimed. Such compositions are particularly suited for investment casting applications, and include a cationically polymerizable component, a radically polymerizable component, a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator, and a free-radical photoinitiator. In other embodiments, the composition may also include a photosensitizer and/or a UV/absorber. Also described and claimed is a method for using a liquid radiation curable resin for additive fabrication with a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator and a certain type of prescribed photosensitizer in an investment casting process.

Radiation curable compositions for additive fabrication are described and claimed. Such compositions are particularly suited for investment casting applications, and include a cationically polymerizable component, a radically polymerizable component, a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator, and a free-radical photoinitiator. In other embodiments, the composition may also include a photosensitizer and/or a UV/absorber. Also described and claimed is a method for using a liquid radiation curable resin for additive fabrication with a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator and a certain type of prescribed photosensitizer in an investment casting process.

Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.

Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.

An epoxy formulation is provided with improved properties for electrical components exposed to a voltage differential. The improved electrical properties include increased glass transition temperature, increased breakdown strength and/or lower loss factor. Electrical components may be formed from the epoxy formulation by 3D printing the epoxy formulation and curing the formulation with UV radiation. The epoxy formulation includes epoxy, a photoinitiator and an accelerator.

An epoxy formulation is provided with improved properties for electrical components exposed to a voltage differential. The improved electrical properties include increased glass transition temperature, increased breakdown strength and/or lower loss factor. Electrical components may be formed from the epoxy formulation by 3D printing the epoxy formulation and curing the formulation with UV radiation. The epoxy formulation includes epoxy, a photoinitiator and an accelerator.

Described is a cationic initiator system comprising a cationic initiator; and an accelerator composition comprising 1) a operoxyketal; and 2) an accelerator compound selected from arylhydroxy compounds and β-diketone compounds.

A compound comprises a moiety selected from a cyclic dimer of a first and a second amino acid or a 2.5-diketopiperazine made from an amino acid. The moiety can be produced by fermentation. The compound further includes a polymerizable group. Additionally, the disclosure includes a method for preparing a resin comprises reacting the compound comprising the foregoing moiety and polymerizable group with a reagent.

Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.