Patent classifications
C08G65/18
Anisotropic copoly(imide oxetane) coatings and articles of manufacture, copoly(imide oxetane)s containing pendant fluorocarbon moieties, oligomers and processes therefor
Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.
Hybrid photopolymer composition for additive manufacturing
The present invention refers to a hybrid photopolymer composition for additive manufacturing, —comprising 50-95% by weight of a free radically curable-component, farther comprising at least one (meth)acrylate monomer or oligomer, 5-49% by weight of a cationically curable component, further comprising a cycloaliphatic epoxide, an oxetane mixture, containing a monooxetane compound and a polyoxetane compound, and a thermoplastic polycaprolactone with a molecular weight of 20,000-100,000 g/mol, a free radical photoinitiator, a UV blocker, a cationic photoinitiator, optionally a cationic photosensitiser, and optionally a thermal initiator, wherein the percent by weight is based on the total weight of the photopolymer' composition. The invention also relates to the use of a photopolymer composition according to the present invention for producing a three-dimensional object through additive manufacturing and to a three-dimensional object obtained through additive manufacturing using the photopolymer composition—according the present invention.
Hybrid photopolymer composition for additive manufacturing
The present invention refers to a hybrid photopolymer composition for additive manufacturing, —comprising 50-95% by weight of a free radically curable-component, farther comprising at least one (meth)acrylate monomer or oligomer, 5-49% by weight of a cationically curable component, further comprising a cycloaliphatic epoxide, an oxetane mixture, containing a monooxetane compound and a polyoxetane compound, and a thermoplastic polycaprolactone with a molecular weight of 20,000-100,000 g/mol, a free radical photoinitiator, a UV blocker, a cationic photoinitiator, optionally a cationic photosensitiser, and optionally a thermal initiator, wherein the percent by weight is based on the total weight of the photopolymer' composition. The invention also relates to the use of a photopolymer composition according to the present invention for producing a three-dimensional object through additive manufacturing and to a three-dimensional object obtained through additive manufacturing using the photopolymer composition—according the present invention.
ENCAPSULATING COMPOSITION
An encapsulating composition and an organic electronic device comprising the same, and the encapsulating composition which is capable of effectively blocking moisture or oxygen penetrating into the organic electronic device from the outside to secure the lifetime of the organic electronic device, implementing a top-emitting organic electronic device, being applied in an inkjet method, and providing a thin display.
ENCAPSULATING COMPOSITION
An encapsulating composition and an organic electronic device comprising the same, and the encapsulating composition which is capable of effectively blocking moisture or oxygen penetrating into the organic electronic device from the outside to secure the lifetime of the organic electronic device, implementing a top-emitting organic electronic device, being applied in an inkjet method, and providing a thin display.
Encapsulating Composition
The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.
PHOTOCURABLE ADHESIVE OR SEALANT COMPOSITION
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. %, of a) at least one oxetane compound according to Formula (I) below:
##STR00001## wherein: R.sup.1, R.sup.2, R.sup.3, R.sup.5 and R.sup.6 are independently selected from H and C.sub.1-C.sub.6 alkyl; R.sup.4 is —(CH.sub.2).sub.mX; m is 0 or 1; X is C.sub.1-C.sub.6 alkyl, C.sub.1-C.sub.6 alkoxy, C.sub.1-C.sub.6 hydroxyalkyl, C.sub.6-C.sub.18 aryl, C.sub.6-C.sub.18 aryloxy, C.sub.7-C.sub.18 aralkyl, C.sub.7-C.sub.18 aralkoxy or is represented by the formula:
##STR00002## each R.sup.7 is independently a C.sub.1-C.sub.12 alkylene group, C.sub.2-C.sub.12 alkenylene group, C.sub.6-C.sub.18 arylene, C.sub.7-C.sub.18 alkarylene, C.sub.7-C.sub.18 aralkylene or a poly(C.sub.1-C.sub.6alkyleneoxy) group; R.sup.8 is H, C.sub.1-C.sub.6 alkyl, C.sub.1-C.sub.6 hydroxyalkyl, C.sub.6-C.sub.18 aryl or C.sub.7-C.sub.18 aralkyl; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt. % of c) at least one ionic photoacid generator; from 0.1 to 5 wt. % of d) at least one free radical photoinitiator; and, from 50 to 90 wt. % of e) particulate filler.
PHOTOCURABLE ADHESIVE OR SEALANT COMPOSITION
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. %, of a) at least one oxetane compound according to Formula (I) below:
##STR00001## wherein: R.sup.1, R.sup.2, R.sup.3, R.sup.5 and R.sup.6 are independently selected from H and C.sub.1-C.sub.6 alkyl; R.sup.4 is —(CH.sub.2).sub.mX; m is 0 or 1; X is C.sub.1-C.sub.6 alkyl, C.sub.1-C.sub.6 alkoxy, C.sub.1-C.sub.6 hydroxyalkyl, C.sub.6-C.sub.18 aryl, C.sub.6-C.sub.18 aryloxy, C.sub.7-C.sub.18 aralkyl, C.sub.7-C.sub.18 aralkoxy or is represented by the formula:
##STR00002## each R.sup.7 is independently a C.sub.1-C.sub.12 alkylene group, C.sub.2-C.sub.12 alkenylene group, C.sub.6-C.sub.18 arylene, C.sub.7-C.sub.18 alkarylene, C.sub.7-C.sub.18 aralkylene or a poly(C.sub.1-C.sub.6alkyleneoxy) group; R.sup.8 is H, C.sub.1-C.sub.6 alkyl, C.sub.1-C.sub.6 hydroxyalkyl, C.sub.6-C.sub.18 aryl or C.sub.7-C.sub.18 aralkyl; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt. % of c) at least one ionic photoacid generator; from 0.1 to 5 wt. % of d) at least one free radical photoinitiator; and, from 50 to 90 wt. % of e) particulate filler.
Epoxy compound, curable composition containing the same, and cured product obtained by curing curable composition
The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. ##STR00001## (In the Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.).
Epoxy compound, curable composition containing the same, and cured product obtained by curing curable composition
The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. ##STR00001## (In the Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.).