C08G73/0655

Resin composition, and prepreg and laminate using the same

The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.

Resist underlayer composition, and method of forming patterns using the composition

A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1; and a solvent and a method of forming patterns using the resist underlayer composition: ##STR00001##
In Chemical Formula 1, at least one of A.sup.1 and A.sup.2 is a group represented by Chemical Formula A: ##STR00002##

Reversible crosslinking reactant composition

A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II) ##STR00001##
wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII), ##STR00002##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.12, R.sup.13, R.sup.14, R.sup.15, R.sup.16, R.sup.17, R.sup.18, R.sup.19, R.sup.20, R.sup.21, R.sup.22, R.sup.23, R.sup.24, R.sup.25, q, z and E are as defined in specification.

Polymer for organic bottom anti-reflective coating and bottom anti-reflective coatings comprising the same

Provided are a polymer for an organic bottom anti-reflective coating and a bottom anti-reflective coating composition containing the same. More specifically, provided are a polymer for an organic bottom anti-reflective coating capable of relieving reflection of exposure light and irradiation light on a substrate of a photoresist layer applied on the substrate in a lithographic process of manufacturing a semiconductor device, and a bottom anti-reflective coating composition containing the same.

DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING

Disclosed are a degradable resin composition including a cyanate ester (A) and a compound (B) having a hydroxyl group with a hydroxyl group equivalent of less than 240 g/eq., and a degradable cured product and a downhole tool for drilling using the same.

Method for forming pattern using antireflective coating composition including photoacid generator

An antireflective coating composition, including a polymer, a photoacid generator having a crosslinkable group, a compound capable of crosslinking the polymer and the photoacid generator, a thermal acid generator, and an organic solvent.

LIQUID COMPRESSION MOLDING ENCAPSULANTS
20210253844 · 2021-08-19 ·

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

Cyanate ester epoxy dual cure resins for additive manufacturing
11090859 · 2021-08-17 · ·

A method of forming a three-dimensional object is carried out by: (a) providing a cyanate ester dual cure resin; (b) forming a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and where said resin is solidified by exposure to light; (c) optionally washing the three-dimensional intermediate, and then (d) heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin and form said three-dimensional object. Compositions useful for carrying out the method, and products made from the method, are also described.

Cyanate ester dual cure resins for additive manufacturing
11040483 · 2021-06-22 · ·

A method of forming a three-dimensional object is carried out by: (a) providing a cyanate ester dual cure resin; (b) forming a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and where said resin is solidified by exposure to light; (c) optionally washing the three-dimensional intermediate, and then (d) heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin and form said three-dimensional object. Compositions useful for carrying out the method, and products made from the method, are also described.

PERSONALIZED, ALLOGENEIC CELL THERAPY OF CANCER
20210139418 · 2021-05-13 ·

The present invention describes methods of preparing a cell composition for treating cancer in a human being by obtaining lymphocytes from a partially or fully HLA-matched healthy donor, activating and expanding T cells reactive to neo-antigens (i.e. new epitopes resulting from somatic mutations in the cancer cell), and enriching for tumor-specific T cells that are not reactive against non-tumor tissue of the cancer patient. Provide herein are lymphocyte compositions comprising partially or fully HLA-matched healthy donor T cells reactive to neo-antigens. Also provided herein are methods of treating human cancer with such neo-antigen-specific, non-alloreactive T cells.