A method for fabricating a shape memory polymer into a three-dimensional object is provided. The method includes forming a film of crosslinked poly(amic acid) on a substrate to provide a laminated substrate; forming the laminated substrate into a first configuration that is in a three-dimensional form; curing the cross-linked poly(amic acid) to provide the shape memory polymer having a permanent shape corresponding to the first configuration; and removing the substrate from the laminated substrate to provide the three-dimensional object comprising the shape memory polymer. The formation of the laminated substrate into the three-dimensional object may be based on origami techniques.

A fast-response thermoplastic shape-memory polyimide and a preparation method thereof, related to a polyimide and a preparation method thereof. The present invention aims to solve the problem in high-temperature conditions of slow shape recovery poor stability, and poor mechanical properties of a shape-memory polymer prepared by utilizing an existing method. The structural formula of the polyamide of the present invention is as represented by formula (I). The preparation method is: 1. preparation of a diamine solution; 2. preparation of an anhydride-terminated high molecular weight polyamic acid; 3. preparation of a viscous sol-gel; and, 4. preparation of the thermoplastic shape-memory polyimide. The thermoplastic shape-memory polyimide prepared per the present invention is provided with a very fast shape recovery rate and improved shape-memory effect. The present invention is applicable in the field of polyimide preparation.

This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.

This disclosure relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth)acrylates; c) at least one catalyst; and d) at least one solvent, as well as related processes and related products. The compositions can form a dielectric film that generates substantially no debris when the dielectric film is patterned by laser ablation process.

Polyimide-network battery-separator compositions are disclosed. The polyimide-network battery-separator compositions comprise a porous cross-linked polyimide network comprising a polyamic acid oligomer. The polyamic acid oligomer (i) comprises a repeating unit of a dianhydride and a diamine and terminal functional groups, (ii) has an average degree of polymerization of 10 to 70, (iii) has been cross-linked via a cross-linking agent, comprising three or more cross-linking groups, at a balanced stoichiometry of the cross-linking groups to the terminal functional groups, and (iv) has been chemically imidized to yield the porous cross-linked polyimide network. The polyimide-network battery-separator compositions also comprise an electrolyte composition comprising (i) a room temperature ionic liquid and (ii) a lithium ion. The electrolyte composition is interfused within the porous cross-linked polyimide network. Polyim ide-urea-network battery-separator compositions also are disclosed. Voltaic cells comprising a cathode, an anode, and the polyimide-network battery separator composition or the polyimide-urea-network battery separator composition are also disclosed.

The present disclosure relates to a polyimide-based block copolymer and a polyimide-based film including the same. The polyimide-based block copolymer according to the present disclosure makes it possible to provide a polyimide-based film exhibiting excellent mechanical properties while being colorless and transparent. The polyimide-based film may be used as a cover film of various flexible or foldable devices.

A composition for preparing at least one of a polyimide and a poly(imide-amide) copolymer, the composition including at least one of a polyamic acid and a poly(amic acid-amide) copolymer, and at least one of a carbodiimide derivative and a carbodiimidazole derivative.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

A fast-response thermoplastic shape-memory polyimide and a preparation method thereof, related to a polyimide and a preparation method thereof. The present invention aims to solve the problem in high-temperature conditions of slow shape recovery poor stability, and poor mechanical properties of a shape-memory polymer prepared by utilizing an existing method. The structural formula of the polyamide of the present invention is as represented by formula (I). The preparation method is: 1. preparation of a diamine solution; 2. preparation of an anhydride-terminated high molecular weight polyamic acid; 3. preparation of a viscous sol-gel; and, 4. preparation of the thermoplastic shape-memory polyimide. The thermoplastic shape-memory polyimide prepared per the present invention is provided with a very fast shape recovery rate and improved shape-memory effect. The present invention is applicable in the field of polyimide preparation.

A method for using citraconic anhydride and itaconic anhydride as addition cure end caps in reactions for forming polyamic acid oligomers and polyimide oligomers, is provided. Prepregs and high temperature adhesives made from the resulting oligomers, as well as, high temperature, low void volume composites made from the prepregs, are also provided.