The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.

The present invention provides a liquid crystal display device that includes: a pair of substrates; a liquid crystal layer held between the substrates; and an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates, the liquid crystal layer containing a liquid crystal material that has a nematic-isotropic phase transition temperature of 75 C. or lower and a nematic phase temperature range narrower than 100 C., the alignment film containing a first polymer and a second polymer, the first polymer having in its main chain at least one selected from a polyamic acid structure and a polyimide structure or a polysiloxane structure, the second polymer being obtained by polymerizing at least one monomer including at least one monomer containing a chalcone group.

The present invention relates to a modified polyimide including a terminal group represented by Formula 1: ##STR00001## wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

A family of low-molecular-weight, main-chain thermotropic liquid-crystalline polyimides (TLC-PI) that are crosslinkable is disclosed. These all-aromatic TLC-PI are derived from (i) wholly aromatic and flexible diamine monomers, in which the linkage between the two aniline-ends contains a relatively high heat-tolerant but flexible chain constituted by two or more units of 1,4-phenoxy or 1,3-phenoxy or in combinations of both. Processes of making and using such all-aromatic TLC-PI is also provided.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive unsaturated cyclic anhydride end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

The invention relates to cross-linkable oligoimides, processes of making such cross-linkable oligoimides and products comprising such cross-linkable oligoimides. Such cross-linkable oligoimides provide articles made by an AM process with the desired process ability that permits filament formation, post cure increased strength, the desired in use temperature stability and the desired thermo-oxidative stability.

A composition for an alignment layer includes a polyimide-based compound including a polymerization initiator coupled to a side chain of the polyimide-based compound.

A system comprises a build area, a precursor feed system to feed polyimide precursor to the build area, and a laser system comprising a laser device to emit a focused energy beam onto the build area, and a laser actuator to aim the focused energy onto selected target locations of the build area in order to selectively initiate polymerization of at least a portion of the polyimide precursor into a structure including polyimide. A method comprises feeding a polyimide precursor to a build area and selectively directing a focused energy beam to the build area to selectively initiate polymerization of at least a portion of the polyimide precursor into a structure including polyimide.

A method of manufacturing a semiconductor device includes placing a polymer raw material mixture over a substrate. The polymer raw material may include a polymer precursor, a photosensitizer, and an additive. The polymer raw material mixture is exposed to radiation to form a dielectric layer and cured at a temperature of between about 150 C. and about 230 C.