A photosensitive resin composition contains (a) a polyimide which has, at a terminal of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, (b) a monomer, (c) a thermally crosslinkable compound, (d) a photopolymerization initiator and (e) a polymerization inhibitor, wherein the polymerization inhibitor (e) is a compound obtained by adding at least one hydroxyl group, alkoxy group, aryloxy group or aralkyloxy group to a naphthalene skeleton or an anthracene skeleton of a compound having a naphthalene skeleton or an anthracene skeleton.

Provided are a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

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A composition for an alignment layer includes a polyimide-based compound including a polymerization initiator coupled to a side chain of the polyimide-based compound.

The present invention relates to a photo-alignment composition for the alignment of liquid crystals. Further the present invention relates to the liquid crystal alignment film and coating layer prepared from the said composition and the use to fabricate optical and electrooptical elements and devices.

A method of manufacturing a semiconductor device includes applying a polymer mixture over a substrate, exposing and developing at least a portion of the polymer mixture to form a developed dielectric, and curing the developed dielectric to form a dielectric layer. The polymer mixture includes a polymer precursor, a photosensitizer, and a solvent. The polymer precursor may be a polyamic acid ester.

A polyimide precursor for producing a flexible electronic device substrate that provides a polyimide with reduced charge-up, particularly a polyimide in the form of a film. When a polyimide film having a thickness of 10 m is formed using the polyimide precursor, and a pair of electrodes is formed with a distance d on the polyimide film, and when the polyimide film is irradiated with a laser beam while applying a DC voltage with an electric field strength of 0.1 to 10 V/m between the pair of electrodes; two SHG lights are observed between the pair of electrodes and satisfy a symmetry ratio of 0.5 or more. The symmetry ratio (LR ratio)=I.sub.small/I.sub.large, wherein, I.sub.large represents the peak intensity of the SHG light with the larger intensity, and I.sub.small represents the peak intensity of the SHG light with the smaller intensity.

A family of low-molecular-weight, main-chain thermotropic liquid-crystalline polyimides (TLC-PI) that are crosslinkable is disclosed. These all-aromatic TLC-PI are derived from (i) wholly aromatic and flexible diamine monomers, in which the linkage between the two aniline-ends contains a relatively high heat-tolerant but flexible chain constituted by two or more units of 1,4-phenoxy or 1,3-phenoxy or in combinations of both. Processes of making and using such all-aromatic TLC-PI is also provided.

Provided are a polyimide or polyimide precursor including a repeating unit represented by Formula (1-1), a resin composition a film.

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There are provided a resin composition containing at least one resin selected from the group consisting of a polyimide and a precursor thereof, in which a dielectric loss tangent of a cured substance obtained by heating the resin composition at 230 C. for 1 hour is less than 0.03, a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device.

Provided are a coloring resin composition including a resin, a coloring material, and a solvent, in which the resin is a polyimide or polyimide precursor including a repeating unit represented by Formula (1-1) or Formula (1-2), and a content of the coloring material is 30 mass % or more with respect to a total solid content of the composition; a film; a color filter; a solid-state imaging element; and an image display device. ##STR00001##