A composition comprising a reactive organic matrix and majority amount of large conductive particles referred to as the primary filler and a minority amount of significantly smaller conductive particles, referred to as the secondary filler. The primary filler and secondary filler are dispersed in a reactive organic matrix and the secondary filler comprises particles with anti-settling characteristics to prevent the primary filler particles from settling without compromising the overall conductivity of the composition.

Provided is a seal material having excellent non-adherence to metal surfaces. The seal material is formed of a cross-linked rubber that is obtained through cross-linking of a cross-linkable rubber composition containing a binary fluororubber, a carbon material, and a polyol cross-linker. The carbon material includes one or more carbon nanotubes. The cross-linked rubber has an adhesion strength of 2 N or less to a metal surface after being heated at 250° C. for 70 hours while in contact with the metal surface.

An inorganic adhesive includes magnesium oxide, magnesium sulfate heptahydrate, silica fume, silica sol, lithium silicate, sodium silicate, citric acid, microcrystalline cellulose, cellulose nanowhiskers, amino trimethylene phosphonic acid, and water.

A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a thermoplastic resin comprising about 30 to about 60 wt % of a rubber-modified aromatic vinyl-based copolymer resin, about 30 to about 60 wt % of a polycarbonate resin, and about 5 to about 25 wt % of a polyester resin; about 0.1 to about 5 parts by weight of zinc oxide; about 0.1 to about 3 parts by weight of a phosphite compound comprising at least one type from among a phosphite compound represented by chemical formula 1 and a phosphite compound represented by chemical formula 2; and about 5 to about 30 parts by weight of a phosphorus-based flame retardant. The thermoplastic resin composition has excellent hydrolysis resistance, flame retardancy, and impact resistance, excellent balance of the foregoing physical properties, and the like.

A method of printing a three dimensional article (201) can include forming a bottom layer of the three dimensional article (201) by spraying a dry build material powder (210) onto a build platform (230) while heating the dry build material powder (210). The dry build material powder (210) can include metal or ceramic particles mixed with a polymeric binder having a softening point temperature. The dry build material powder (210) can be heated to a temperature above the softening point temperature such that the dry build material powder (210) adheres to the build platform (230). Subsequent layers can be formed by spraying dry build material powder (210) onto a lower layer while heating the dry build material powder (210) such that the dry build material powder (210) adheres to the lower layer.

Provided are an encapsulation structure, a production method thereof, a glue-spreading device, and an encapsulation glue. The encapsulation structure has an encapsulation glue layer, wherein the encapsulation glue layer has an adhesive layer formed from an adhesive glue and a desiccant composition core formed from a colloidal desiccant composition, wherein the adhesive layer fully envelops the desiccant composition core, wherein the colloidal desiccant composition has a colloidal desiccant-dispersing medium and a desiccant dispersed in the colloidal desiccant-dispersing medium.

Disclosed herein are thermal interface materials based on two-part polyurethane resins comprising a polyurethane resin and a thermally conductive filler dispersed throughout the polyurethane resin, wherein the polyurethane resin is formed from two parts comprising: a first part comprising a triol, and a second part comprising an isocyanate-functionalized component, wherein at least one of the first part and the second part comprises a thermally conductive filler material.

Disclosed is a dipping composite material for enhancing the cut resistance of chemical-resistant gloves, wherein an additive is added to a latex, and the additive is a metal oxide and/or silica and/or glass fiber and/or basalt fiber and/or aramid fiber. The present invention improves the formula of a dipping layer such that the dipping layer has the cut resistance, which can significantly improve the cut resistant level of gloves.

The present invention provides a polyformaldehyde composite material, in parts by weight, including the following components: 70 to 95 parts of a polyformaldehyde; 5 to 20 parts of a SEBS; wherein, the SEBS is acid modified or amine modified. Due to modification by acid or amine, and presence of a polystyrene segment, a compatibility of the SEBS with the polyformaldehyde reduces because of a steric hindrance effect, which reduces an ability of a POM molecular chain to arrange regularly. When injection molded into a product or template, an incompatibility of the material itself will form a micro-rough effect on a surface of the material. When an incident light reaches the micro-rough surface, a reflection direction of the light will change and thus a diffuse reflection occurs, and a low-gloss material is obtained.

A positive electrode active material for a secondary battery and a method of making the same are disclosed herein. In some embodiments, a positive electrode active material includes lithium composite transition metal oxide particles including 70 mol % or more of nickel (Ni) among total metals excluding lithium, and a coating portion formed on surfaces of the lithium composite transition metal oxide particles, wherein the coating portion includes a compound including fluorine and at least one selected from the group consisting of aluminum (Al), titanium (Ti), magnesium (Mg), zirconium (Zr), tungsten (W), and strontium (Sr), wherein the positive electrode active material has a Brunauer-Emmett-Teller (BET) specific surface area is in a range of 0.1 m.sup.2/g to 0.9 m.sup.2/g, and an amount of a lithium by-product on a surface of the positive electrode active material is 0.65 wt % or less based on a total weight of the positive electrode active material.