The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

A resin composition comprises: a base resin containing an oligomer, a monomer, and a photopolymerization initiator; and inorganic oxide particles, wherein the inorganic oxide particles are lump-shaped aggregated particles, and the volume average particle size of the inorganic oxide particles measured by an X-ray small angle scattering method is 5 nm or more and 800 nm or less.

The present invention is directed towards curable film-forming coating compositions comprising metal particles; an alkaline earth metal compound comprising an alkaline earth metal oxide, an alkaline earth metal carbonate, an alkaline earth metal hydroxide, an alkaline earth metal sulfate, an alkaline earth metal monocarboxylate, an alkaline earth metal phosphate, or combinations thereof; and an organic film-forming binder. Also disclosed are methods of making curable film-forming coating compositions, methods of coating substrates, and coated substrates resulting therefrom.

The present invention relates to a curable composition comprising: at least one polymer comprising cure sites [polymer (E)], at least one thermoplastic polymer [thermoplastic (P)] different from said polymer (E) and at least one 1,5 enediyne curing agent [agent (C)], and to a blend obtained by dynamic vulcanization of said composition.

A resin composition for coating an optical fiber comprises: a base resin containing a photopolymerizable compound and a photopolymerization initiator; and hydrophobic inorganic oxide particles, wherein the photopolymerizable compound comprises urethane (meth)acrylate and aliphatic epoxy (meth)acrylate, and the content of the aliphatic epoxy (meth)acrylate is 1.0% by mass or more and 45% by mass or less based on the total amount of the photopolymerizable compound.

Provided are: a spherical magnesium oxide having not only high sphericity but also smooth surface and having excellent moisture resistance and excellent filling properties, and a method producing the same. In the present invention, by controlling the boron and iron contents of the calcined magnesium oxide to be in the respective predetermined ranges, there is provided a spherical magnesium oxide having a volume-based cumulative 50% particle diameter (D50), as measured by a laser diffraction/scattering particle size distribution measurement, in the range of from 3 to 200 μm, which is the range for a relatively large particle diameter, and a high sphericity of 1.00 to 1.20, as measured from viewing a SEM photomicrograph, as well as smooth surface, and having excellent moisture resistance and excellent filling properties. A predetermined spherical magnesium oxide is provided by virtue of the synergies obtained from the boron content of 300 to 2,000 ppm and the iron content of 100 to 1,500 ppm.

Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

There is provided a heat-conductive flexible sheet that is formed of a non-silicone material and excellent in flexibility as well as durability such as heat-aging resistance, hydrothermal resistance, and thermal shock resistance, and a heat dissipation structure using the same, as well as a resin composition that exhibits excellent handleability in the kneading step in producing a heat-conductive sheet and can be suitably used as a binder material for a heat-conductive flexible sheet. A resin composition comprising a blocked urethane prepolymer, a predetermined epoxy compound, and a curing catalyst, the blocked urethane prepolymer being a reaction product of an aliphatic diisocyanate compound and a hydrogenated polybutadiene polyol having a hydroxy group at each of both ends, wherein the reaction product has at an end thereof an isocyanate group blocked with an aromatic hydroxy compound; a heat-conductive flexible sheet formed of a cured product of a mixed composition comprising the same and a heat-conductive inorganic filler; and a heat dissipation structure using the same.

A heat resistant ABS thermoplastic molding composition with reduced odor can be employed for automotive interior applications if it comprises a graft copolymer (A) based on a diene rubber latex substrate with a SAN graft sheath; a SAN matrix polymer (B) and specific amounts of additives such as fatty acid amides or fatty acid esters,metal oxides such as MgO, CaO or ZnO, antioxidants and a silicon oil having a kinematic viscosity in the range of from 25000 to 80000 centi Stokes.

Disclosed are a thermoplastic polyamide resin composition, a method for preparing the same and a molded article produced thereby. The molded article may have improved impact strength and heat resistance, produced from the thermoplastic polyamide resin composition including a nucleating agent containing an aromatic polyamide and a heat-dissipation filler, polyamide 66 and polyamide 6, thereby improving the speed of process and realize uniform crystallization.