Patent classifications
C08K5/1539
USE OF MONO-SUBSTITUTED SUCCINIC ANHYDRIDE
The present invention refers to the use of at least one mono-substituted succinic anhydride before or during extrusion of a polymer composition comprising polylactic acid as polymer component and at least one calcium carbonate-comprising material as filler, to reduce the polymer decomposition during processing and/or to decrease the melt flow rate of such an extruded polymer as well as a method for reducing the polymer decomposition during processing and decreasing the melt flow rate of a polymer composition comprising polylactic acid as polymer component and at least one calcium carbonate-comprising material as filler, the use of a polymer composition obtainable by a process comprising the steps of a) providing at least one polylactic acid as polymer component, b) providing at least one calcium carbonate-comprising material as filler, c) providing at least one mono-substituted succinic anhydride and d) contacting the components of a), b) and c) in any order and e) extruding the contacted components of step d) as well as an article comprising a polymer composition obtainable by the aforementioned process.
USE OF MONO-SUBSTITUTED SUCCINIC ANHYDRIDE
The present invention refers to the use of at least one mono-substituted succinic anhydride before or during extrusion of a polymer composition comprising polylactic acid as polymer component and at least one calcium carbonate-comprising material as filler, to reduce the polymer decomposition during processing and/or to decrease the melt flow rate of such an extruded polymer as well as a method for reducing the polymer decomposition during processing and decreasing the melt flow rate of a polymer composition comprising polylactic acid as polymer component and at least one calcium carbonate-comprising material as filler, the use of a polymer composition obtainable by a process comprising the steps of a) providing at least one polylactic acid as polymer component, b) providing at least one calcium carbonate-comprising material as filler, c) providing at least one mono-substituted succinic anhydride and d) contacting the components of a), b) and c) in any order and e) extruding the contacted components of step d) as well as an article comprising a polymer composition obtainable by the aforementioned process.
REMOVABLE SILICONE FILMS AND RELATED METHODS
Reversibly crosslinkable compositions are provided for forming removable crosslinked films. A reversibly crosslinkable composition may comprise entangled chains of a polysiloxane comprising pendant functional groups having formula NH(CO)XCOOH, wherein X is an alkyl group, an alkenyl group, or an aryl group; a plurality of inorganic oxide nanoparticles; and a solvent; wherein non-covalent bonds between the pendant functional groups and the inorganic oxide nanoparticles crosslink the entangled chains to form a polymeric matrix in the absence of the solvent, wherein the non-covalent bonds dissociate and the polymeric matrix collapses in the presence of water and heat.
REMOVABLE SILICONE FILMS AND RELATED METHODS
Reversibly crosslinkable compositions are provided for forming removable crosslinked films. A reversibly crosslinkable composition may comprise entangled chains of a polysiloxane comprising pendant functional groups having formula NH(CO)XCOOH, wherein X is an alkyl group, an alkenyl group, or an aryl group; a plurality of inorganic oxide nanoparticles; and a solvent; wherein non-covalent bonds between the pendant functional groups and the inorganic oxide nanoparticles crosslink the entangled chains to form a polymeric matrix in the absence of the solvent, wherein the non-covalent bonds dissociate and the polymeric matrix collapses in the presence of water and heat.
DISINTEGRATABLE BISMALEIMIDE COMPOSITES FOR DOWNHOLE TOOL APPLICATIONS
A method for operating in a borehole comprises disposing in a downhole environment an article comprising a bismaleimide composite which comprises a polybismaleimide and a disintegrating agent; exposing the article to an aqueous fluid at a temperature of about 25 C. to about 300 C.; and disintegrating the article.
DISINTEGRATABLE BISMALEIMIDE COMPOSITES FOR DOWNHOLE TOOL APPLICATIONS
A method for operating in a borehole comprises disposing in a downhole environment an article comprising a bismaleimide composite which comprises a polybismaleimide and a disintegrating agent; exposing the article to an aqueous fluid at a temperature of about 25 C. to about 300 C.; and disintegrating the article.
Hot melt adhesive and disposable product
Disclosed is a hot melt adhesive comprising: (A) a thermoplastic block copolymer which is a block copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound; and (B) an amorphous wax modified with a carboxylic acid and/or a carboxylic anhydride. The hot melt adhesive is excellent in applicability at a low temperature near from about 140 C. to about 150 C. and excellent in creep resistance in a wet state, can reduce odor, is excellent in initial adhesive force, and is excellent in adhesive property (peel strength) to an olefin substrate. This hot melt adhesive can be used suitably so as to produce a disposable product.
Hot melt adhesive and disposable product
Disclosed is a hot melt adhesive comprising: (A) a thermoplastic block copolymer which is a block copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound; and (B) an amorphous wax modified with a carboxylic acid and/or a carboxylic anhydride. The hot melt adhesive is excellent in applicability at a low temperature near from about 140 C. to about 150 C. and excellent in creep resistance in a wet state, can reduce odor, is excellent in initial adhesive force, and is excellent in adhesive property (peel strength) to an olefin substrate. This hot melt adhesive can be used suitably so as to produce a disposable product.
Thermosetting resin composition, cured film, substrate with cured film, and electronic component
Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
Thermosetting resin composition, cured film, substrate with cured film, and electronic component
Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.