This is to achieve low temperature toughness in a blow molded product, blow molding properties such as mold transferability, suppression of burning, suppression of surface unevenness, drawdown property and dimensional stability of the blow molded product, and blister resistance in combination.

A polyamide resin composition of the present invention comprises 60 to 85% by mass of a polyamide resin (A), 20% by mass or more of an olefin-based ionomer (B) and 5 to 20% by mass of an impact resistant material (C) in 100% by mass of the polyamide resin composition, and contains 20% by mass or more of an aliphatic copolymerized polyamide (A-1) in 100% by mass of the polyamide resin (A).

This is to achieve low temperature toughness in a blow molded product, blow molding properties such as mold transferability, suppression of burning, suppression of surface unevenness, drawdown property and dimensional stability of the blow molded product, and blister resistance in combination.

A polyamide resin composition of the present invention comprises 60 to 85% by mass of a polyamide resin (A), 20% by mass or more of an olefin-based ionomer (B) and 5 to 20% by mass of an impact resistant material (C) in 100% by mass of the polyamide resin composition, and contains 20% by mass or more of an aliphatic copolymerized polyamide (A-1) in 100% by mass of the polyamide resin (A).

Provided are a resin composition for sealing an optical semiconductor providing both UV transmission and heat resistance, and a molded resin product for sealing an optical semiconductor, an optical semiconductor-sealing material, and an optical semiconductor device each including the same. The resin composition satisfies the relationship X=(A1×A2)/A3+(B1×B2)/B3+ . . . <0.0005 wherein A1 represents the mass ratio of an aromatic compound, A2 represents the number of aromatic rings per molecule of the aromatic compound, A3 represents the molecular weight of the aromatic compound, and A, B, . . . each represent an aromatic compound. The composition contains an epoxy, an alicyclic acid anhydride, and an antioxidant. When formed into a cured product (size: 50 mm in width×50 mm in length×1 mm in thickness), a linear transmittance at 300 nm is 80% or higher and a linear transmittance at 400 nm is 95% or higher.

Provided are a resin composition for sealing an optical semiconductor providing both UV transmission and heat resistance, and a molded resin product for sealing an optical semiconductor, an optical semiconductor-sealing material, and an optical semiconductor device each including the same. The resin composition satisfies the relationship X=(A1×A2)/A3+(B1×B2)/B3+ . . . <0.0005 wherein A1 represents the mass ratio of an aromatic compound, A2 represents the number of aromatic rings per molecule of the aromatic compound, A3 represents the molecular weight of the aromatic compound, and A, B, . . . each represent an aromatic compound. The composition contains an epoxy, an alicyclic acid anhydride, and an antioxidant. When formed into a cured product (size: 50 mm in width×50 mm in length×1 mm in thickness), a linear transmittance at 300 nm is 80% or higher and a linear transmittance at 400 nm is 95% or higher.

Disclosed are solvent cement formulations having beneficial stability and performance characteristics that include a thermoplastic resin, one or more organic solvents, an inhibitor of an oxidation-reduction reaction, and a heat stabilizer.

Disclosed are solvent cement formulations having beneficial stability and performance characteristics that include a thermoplastic resin, one or more organic solvents, an inhibitor of an oxidation-reduction reaction, and a heat stabilizer.

The present invention relates to a process for the long-term stabilization of polyamides and the use of a specific additive composition for the long-term stabilization of polyamides.

The present invention relates to the use of specific cinnamic acid esters as stabilizers of organic materials, in particular against oxidative, thermal and/or actinic degradation. The invention also relates to a corresponding stabilized organic material. The invention further relates to a method for stabilizing organic materials, in which specific cinnamic acid esters are incorporated into the organic material. According to the invention, specific new cinnamic acid esters are also disclosed.

The present invention relates to the use of specific cinnamic acid esters as stabilizers of organic materials, in particular against oxidative, thermal and/or actinic degradation. The invention also relates to a corresponding stabilized organic material. The invention further relates to a method for stabilizing organic materials, in which specific cinnamic acid esters are incorporated into the organic material. According to the invention, specific new cinnamic acid esters are also disclosed.

The present invention relates to the use of specific cinnamic acid esters as stabilizers of organic materials, in particular against oxidative, thermal and/or actinic degradation. The invention also relates to a corresponding stabilized organic material. The invention further relates to a method for stabilizing organic materials, in which specific cinnamic acid esters are incorporated into the organic material. According to the invention, specific new cinnamic acid esters are also disclosed.