The present invention relates to stabilizers for thiol-ene compositions and to radiation curable thiol-ene compositions based thereon. Such radiation curable compositions can advantageously be used in inks, overprint varnishes, coatings, adhesives, for the making of 3D objects and for the making of solder resist and gel nails.

Provided in particular is an inhibitor system (I) for thiol-ene compositions based on at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, at least one acidic compound (ii) having a pKa between 1 and 3, and at least one compound (iii) selected from the group consisting of phosphites and phosphonites,
with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring.

Also provided is an inhibitor system (II) for thiol-ene compositions based on that is based on at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, at least one compound (iv) selected from the group consisting of spirophosphites, and optionally, at least one acidic compound (ii) having a pKa between 1 and 3, and
with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring.

A resin composition which comprises 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, 5 to 80 parts by weight of an ethylene--olefin copolymer, 1 to 30 parts by weight of an epoxy group-containing silicon elastomer and 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, phosphite compound, phosphonite compound and thioether compound and has low-temperature impact resistance and suppresses delamination.

A resin composition which comprises 100 parts by weight of a resin having a carboxyl group in at least part of the end of the molecular chain, 5 to 80 parts by weight of an ethylene--olefin copolymer, 1 to 30 parts by weight of an epoxy group-containing silicon elastomer and 0.01 to 3 parts by weight of at least one antioxidant selected from the group consisting of hindered phenol compound, phosphite compound, phosphonite compound and thioether compound and has low-temperature impact resistance and suppresses delamination.

A flame retardant sugar-derived molecule, a process for forming a flame retardant sugar-derived molecule, and an article of manufacture comprising a flame retardant sugar-derived molecule are disclosed. The flame retardant sugar-derived molecule can be synthesized from arabitol, xylitol, arabic acid, or xylonic acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame retardant sugar-derived molecule can include reacting arabitol, xylitol, arabic acid, or xylonic acid and a flame retardant phosphorus-based molecule to form the flame retardant sugar-derived molecule.

A flame retardant sugar-derived molecule, a process for forming a flame retardant sugar-derived molecule, and an article of manufacture comprising a flame retardant sugar-derived molecule are disclosed. The flame retardant sugar-derived molecule can be synthesized from arabitol, xylitol, arabic acid, or xylonic acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame retardant sugar-derived molecule can include reacting arabitol, xylitol, arabic acid, or xylonic acid and a flame retardant phosphorus-based molecule to form the flame retardant sugar-derived molecule.

A process of forming a resveratrol-based flame retardant small molecule with a phosphonate/phosphinate molecule that includes a chloride group and a terminal functional group.

A process of forming a resveratrol-based flame retardant small molecule with a phosphonate/phosphinate molecule that includes a chloride group and a terminal functional group.

The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

A polyisocyanurate foam insulation product includes polyisocyanurate foam produced from reacting an isocyanate and a polyol blend having a functionality of at least 2.2. The isocyanate and the polyol blend are reacted so that the polyisocyanurate foam has an isocyanate index equivalent with or greater than 300. The polyisocyanurate foam includes a fire retardant and includes between 0.02 and 0.45 weight percent of a zinc salt compound. The foam insulation board exhibits a flame spread of no greater than 25 and a smoke index of no greater than 50 when exposed to flame conditions in accordance with an ASTM E-84 test.