A facestock for an adhesive label, an adhesive label and an adhesive label laminate including an uniaxially in machine direction oriented facestock is disclosed. According to an embodiment a core layer includes the following components: propylene homopolymer; a modifier consisting of at least one of the following: olefin elastomer, olefin plastomer and olefin block copolymer; and low density polyethylene. Further the use of the adhesive label for labelling of an article is also disclosed.

The present disclosure provides an elastomer composition, comprising, based on the total weight 100 wt. % of the elastomer composition: 1-50 wt. % of a modified ethylene propylene copolymer; 5-60 wt. % of a first silicone resin, the first silicone resin comprising at least one selected from the group consisting of the following: a hydroxyl-terminated silicone resin and an alkoxy-terminated silicone resin; 0.1-15 wt. % of a first crosslinking agent; 0.1-15 wt. % of a catalyst; and 10-85 wt. % of a filler. The elastomer composition provided by the present disclosure at least can be co-crosslinked in low temperature (approximately −20° C. to 60° C.) conditions. An elastomer prepared from the elastomer composition provided by the present disclosure has good mechanical properties and electrical insulation properties.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

The present invention provides a polymer composition for fibers or non-woven fabrics, comprising a vinyl aromatic based copolymer and 0 to 30 wt % of an olefin based polymer based on the total weight of the polymer composition. The vinyl aromatic copolymer is represented by a formula A1-B-A2, wherein block A1 and block A2 are the same or different vinyl aromatic blocks, block A1 or block A2 having 3,800 to 4,800 of a peak molecular weight, and block B is a hydrogenated conjugated diene block. A vinyl structure content of a conjugated diene monomer content in the vinyl aromatic based copolymer is from 32 wt % to 50 wt %; and a melt flow index (MFI) of the vinyl aromatic based copolymer is 20 g/10 min˜60 g/10 min (230° C., 2.16 kg). The present invention also provides the fibers or the non-woven fabrics made from the polymer composition.

The present invention provides a polymer composition for pressure sensitive adhesives or films thereof. The polymer composition comprises 20-40 parts by weight of a tackifier; and 60-80 parts by weight of a polymer, wherein the polymer and the tackifier are 100 parts by weight. The polymer comprises at least a first vinyl aromatic based copolymer formed by polymerization of vinyl aromatic monomer and conjugated diene monomer, wherein a vinyl aromatic monomer content of the first vinyl aromatic based copolymer is 16 wt %˜28 wt %, a vinyl structure content of a conjugated diene monomer content in the first vinyl aromatic based copolymer is 32 wt %˜50 wt %; and a melt flow index (MFI) of the first vinyl aromatic based copolymer is 20 g/10 min˜60 g/10 min (230° C., 2.16 kg). The present invention also provides the pressure sensitive adhesives or films made from the polymer composition.

The description relates to solvent free films and textiles that receive the solvent free films.

A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 m, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 m.

An isolator for protecting adjacently located dissimilar material substrates from galvanic corrosion. The isolator includes a backing layer having opposite major surfaces and a thickness, and an optional uncured adhesive layer having one major surface bonded to one of the major surfaces of the backing layer and another major exposed surface for being adhesively bondable to a surface of one of the dissimilar material substrates. In its cured state, the adhesive layer and the backing layer are each not permanently compressible. At least one or both of the cured adhesive layer and the backing layer is polar solvent resistant enough to prevent polar solvent transported metal ions from passing all the way through its thickness. In preferred embodiments the backing layer comprises a tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride (THV) material, and the adhesive layer comprises an epoxy resin.

A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.

An adhesive clamp for reclosing a packaging bag, the adhesive clamp comprises a tape having one side of the tape coated with an adhesive substance and a clamping strip of foldable non-elastic material attached to the adhesive side of the tape and where the tape is wider and longer than the clamping strip.