C09J123/0815

PACKAGING ADHESIVES COMPRISING LOW VOLATILE TACKIFIER COMPOSITIONS

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

PRODUCT ASSEMBLY ADHESIVES COMPRISING LOW VOLATILE TACKIFIER COMPOSITIONS

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

HYGIENE ADHESIVES COMPRISING LOW VOLATILE TACKIFIER COMPOSITIONS

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

PROCESSES FOR MAKING LOW VOLATILE TACKIFIER COMPOSITIONS

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

ENCAPSULATING COMPOSITION AND ENCAPSULATING FILM COMPRISING SAME AND ELECTRONIC COMPONENT ASSEMBLY

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene--olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene--olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

ENCAPSULATING COMPOSITION AND ENCAPSULATING FILM COMPRISING SAME AND ELECTRONIC COMPONENT ASSEMBLY

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene--olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene--olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

BUTENE-1 POLYMER COMPOSITION HAVING HIGH MELT FLOW RATE

A butene-1 polymer composition having a MFR value of from 100 to 300 g/10 min., measured according to ISO 1133 at 190 C. with a load of 2.16 kg, made from or containing: A) a butene-1 homopolymer or a copolymer of butene-1 with one or more comonomers selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of up to 5% by mole; B) a copolymer of butene-1 with one or more comonomers selected from the group consisting of ethylene and higher alpha-olefins, having a copolymerized comonomer content of from 6% to 20% by mole;
wherein the composition having a total copolymerized comonomer content from 4% to 15% by mole, referred to the sum of A) and B), and a content of fraction soluble in xylene at 0 C. of 75% by weight or less, determined on the total weight of A) and B).

Adhesive Composition
20200172714 · 2020-06-04 ·

The present disclosure provides a composition. In an embodiment a composition is provided and includes: (A) an ethylene-based interpolymer having the following: (i) a density from 0.860 g/cc to 0.900 g/cc; and (ii) a melt viscosity, at 177 C., less than, or equal to, 50,000 mPa.Math.s; and (B) a rosin ester containing the following: (i) greater than, or equal to, 75 mol % aliphatic carbon, based on total moles of carbon in the rosin ester; and (ii) less than, or equal to, 3.0 mol % ester group carbon, based on total moles of carbon in the rosin ester.

Adhesive Composition
20200172714 · 2020-06-04 ·

The present disclosure provides a composition. In an embodiment a composition is provided and includes: (A) an ethylene-based interpolymer having the following: (i) a density from 0.860 g/cc to 0.900 g/cc; and (ii) a melt viscosity, at 177 C., less than, or equal to, 50,000 mPa.Math.s; and (B) a rosin ester containing the following: (i) greater than, or equal to, 75 mol % aliphatic carbon, based on total moles of carbon in the rosin ester; and (ii) less than, or equal to, 3.0 mol % ester group carbon, based on total moles of carbon in the rosin ester.

HOT MELT ADHESIVE
20200123418 · 2020-04-23 ·

Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.