C09J123/0853

Packaging adhesives comprising low volatile tackifier compositions

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

APPLICATION OF ADHESIVES
20230082593 · 2023-03-16 ·

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Modified ethylene vinyl acetate compositions, polymer blends and films made therefrom

Compositions may include an EVA copolymer produced from ethylene, vinyl acetate, and one or more polar comonomers, wherein at least one of the one or more polar comonomers include an amine moiety. Methods may include preparing a polymer composition by adding ethylene, vinyl acetate and one or more polar comonomers to a reactor or extruder, wherein at least one of the one or more polar comonomers include an amine moiety; and reacting the ethylene, vinyl acetate and one or more comonomers to produce the polymer composition. Compositions may include an adhesive film composition that include at least one layer including a polymer produced from ethylene, vinyl acetate, and one or more polar comonomers, wherein at least one of the one or more polar comonomers include an amine moiety.

Encapsulating composition and encapsulating film comprising same and electronic component assembly

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

Encapsulating composition and encapsulating film comprising same and electronic component assembly

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

Compositions containing rosin esters

Disclosed are compositions which include an ethylene polymer derived from at least one polar monomer with one or more ester groups, and a rosin ester. The rosin ester can have a low hydroxyl number (e.g., a hydroxyl number seven or less), a low acid number (e.g., an acid number of ten or less), a relatively low PAN number (e.g., a PAN number less than twenty-five), a relatively high third moment or third power average molecular weight (Mz), (e.g., an Mz value in between 2500 and 12000 g/mol), a low sulfur content (e.g., a sulfur content lower than 600 ppm prior to antioxidant addition) or combinations thereof. The compositions can exhibit a high heat stress resistance (e.g., a heat stress pass temperature value higher than 52° C. or in between 48° C. and 60° C.) and/or improved viscosity stability and/or color stability upon thermal aging and/or improved compatibility.

Compositions containing rosin esters

Disclosed are compositions which include an ethylene polymer derived from at least one polar monomer with one or more ester groups, and a rosin ester. The rosin ester can have a low hydroxyl number (e.g., a hydroxyl number seven or less), a low acid number (e.g., an acid number of ten or less), a relatively low PAN number (e.g., a PAN number less than twenty-five), a relatively high third moment or third power average molecular weight (Mz), (e.g., an Mz value in between 2500 and 12000 g/mol), a low sulfur content (e.g., a sulfur content lower than 600 ppm prior to antioxidant addition) or combinations thereof. The compositions can exhibit a high heat stress resistance (e.g., a heat stress pass temperature value higher than 52° C. or in between 48° C. and 60° C.) and/or improved viscosity stability and/or color stability upon thermal aging and/or improved compatibility.

Shrinkable film capable of being overlapped and heat sealed, preparation method therefor, and packaging bag prepared using same

A shrinkable film capable of being overlapped and heat sealed, a preparation method for the film, and a packaging bag prepared using same, including outer surface layers and a heat sealing layer. Each outer surface layer includes a low-molecular weight compound and is subjected to electron cross-linking treatment, and the low-molecular weight compound is selected from paraffin, oleamide, stearic acid, and one or more of their derivatives. The low-molecular weight compound in each outer surface layer can, during overlapping and heat sealing, be migrated in a polymer under the action of being heated to influence movement of polymer molecular chains, and can be migrated to two molten interfaces to hinder mutual penetration of the polymer molecular chains. Further, by performing electronic cross-linking treatment on the outer surface layers, the outer surface layers form a polymer molecular chain cross-linking structure, and the movement of the polymer molecular chains is reduced.

Shrinkable film capable of being overlapped and heat sealed, preparation method therefor, and packaging bag prepared using same

A shrinkable film capable of being overlapped and heat sealed, a preparation method for the film, and a packaging bag prepared using same, including outer surface layers and a heat sealing layer. Each outer surface layer includes a low-molecular weight compound and is subjected to electron cross-linking treatment, and the low-molecular weight compound is selected from paraffin, oleamide, stearic acid, and one or more of their derivatives. The low-molecular weight compound in each outer surface layer can, during overlapping and heat sealing, be migrated in a polymer under the action of being heated to influence movement of polymer molecular chains, and can be migrated to two molten interfaces to hinder mutual penetration of the polymer molecular chains. Further, by performing electronic cross-linking treatment on the outer surface layers, the outer surface layers form a polymer molecular chain cross-linking structure, and the movement of the polymer molecular chains is reduced.

Hygiene adhesives comprising low volatile tackifier compositions

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.