A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.

Methods of treating metal nanocrystals are provided. In embodiments, such a method comprises exposing metal nanocrystals comprising a metal and characterized by at least one twinning boundary therein, to a plating solution comprising a reducing agent and coating metal cations comprising a different metal, under conditions to form a coating of the different metal on surfaces of the metal nanocrystals via electroless deposition by chemical reduction of the coating metal cations, thereby providing coated metal nanocrystals. Methods of forming bulk nanostructured metal alloys from the coated metal nanocrystals are also provided.

An aluminum alloy substrate for magnetic disks, including an aluminum alloy containing: 1.0 to 6.5 mass % of Mg; and the balance consisting of Al and unavoidable impurities, in which the distribution of Si—K—O-based particles with a longest diameter of 1 μm or more adhering to the surface from the surrounding environment is equal to or less than one particle/6,000 mm.sup.2; and in which the distribution of Ti—B-based particles with a longest diameter of 1 μm or more present on the surface is equal to or less than one particle/6,000 mm.sup.2, and a magnetic disk using the aluminum alloy substrate for magnetic disks.

Multi-terminal capacitor devices and methods of making multi-terminal capacitor devices are described herein. The multi-terminal capacitor devices may include a plurality of individual capacitors arranged in a single device layer, such as high surface area capacitors. A individual capacitor may include an aluminum foil-based electrode, an aluminum oxide dielectric layer conformal with the aluminum foil-based electrode, and a conductive material electrode, such as a conducting polymer or a conductive ceramic, in conformal contact with the dielectric layer.

Compositions for electroless plating baths and their use are disclosed, and more particularly different solutions each usable to both makeup an original bath and to replenishment of the original bath.

A touch input device and a method for manufacturing the same are disclosed. The touch input device includes: a first base including a metal compound; a first pattern groove formed over one surface of the first base; a first sense pattern formed over the first pattern groove and including a conductive material; a second base stacked over the first base, and configured to include a metal compound; a second pattern groove formed over one surface of the second base; a second sense pattern formed over the second pattern groove, including a conductive material, and spaced apart from the first sense pattern; and a line unit connecting the first sense pattern and the second sense pattern to an integrated-circuit.

An aluminum alloy substrate for magnetic disks, including an aluminum alloy containing Fe as an essential element; at least one of Mn or Ni as selective elements; and the balance including Al and unavoidable impurities, with the total amount of Fe, Mn, and Ni having a relationship of 0.10 to 7.00 mass %; in which the distribution of Si—K—O-based particles with a longest diameter of 1 μm or more adhering to the surface from the surrounding environment is equal to or less than one particle/6,000 mm.sup.2, and in which the distribution of Ti—B-based particles with a longest diameter of 1 μm or more present on the surface is equal to or less than one particle/6,000 mm.sup.2; and a magnetic disk using the aluminum alloy substrate.

Electroless underwater metal plating of a surface of fixed or floating structure is accomplished by transferring to the surface metal ions from a metal precursor in a solid or semisolid electrolyte that is pressed against and moved over a submerged surface. Metal ions from a metal salt blended in the solid or semisolid material plate the underwater substrate.