Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology. Nano-scale channels structures are etched, so that the super-hydrophobic inner surface can have a better ability to store air, and its water flow impact resistance is greatly enhanced.

A multifunctional coating method involves cleaning a surface, applying a layer of corrosion-resistant alloy coating to the surface, and applying an oleo-hydrophobic composite coating over the corrosion-resistant alloy coating. An oil and gas pipe has an inner surface with a multifunctional coating applied using the multifunctional coating method, and has an inner oleo-hydrophobic composite coating, beneath the inner oleo-hydrophobic composite coating a corrosion-resistant alloy coating, and beneath the corrosion-resistant alloy coating untreated pipe or any other metallic substrate.

A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

A system for coating an interior surface of a heat exchanger includes a tank for storing the coating solution, a pump, a source line for supplying the coating solution to the heat exchanger, and a return line for returning the remainder of the coating solution to the tank. The system can include a pre-treatment line for supplying a pre-treatment solution to the heat exchanger and a water line for supplying water to the heat exchanger. An air compressor can be coupled to the heat exchanger to force the coating solution, the pre-treatment solution, or the water from the heat exchanger.

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 m.

A framework of copper oxide dendrites is formed on a copper substrate, and these are then coated or plated with silver, gold, or an equivalent metal to create metal-coated dendrites with nano-structures, favorably in range of 50 to 200 nanometers. The framework of metal-coated dendrites are well suited for use in surface-enhanced Raman spectroscopy and other practical applications.

A system for coating an interior surface of a heat exchanger includes a tank for storing the coating solution, a pump, a source line for supplying the coating solution to the heat exchanger, and a return line for returning the remainder of the coating solution to the tank. The system can include a pre-treatment line for supplying a pre-treatment solution to the heat exchanger and a water line for supplying water to the heat exchanger. An air compressor can be coupled to the heat exchanger to force the coating solution, the pre-treatment solution, or the water from the heat exchanger.

There are provided: an aluminum alloy magnetic disk substrate including: an aluminum alloy base material including an aluminum alloy containing 0.4 to 3.0 mass % (hereinafter, simply referred to as %) of Fe, 0.1 to 3.0% of Mn, 0.005 to 1.000% of Cu, and 0.005 to 1.000% of Zn, with the balance of Al and unavoidable impurities; and an electroless NiP plated layer formed on a surface of the aluminum alloy base material, in which the peak value (BLEI) of Fe emission intensity at an interface between the electroless NiP plated layer and the aluminum alloy base material, as determined by a glow discharge optical emission spectrometry device, is lower than Fe emission intensity (AlEI) in the interior of the aluminum alloy base material, as determined by the glow discharge optical emission spectrometry device; and a method for producing the aluminum alloy magnetic disk substrate.

A method for forming a circuit pattern on an integrated substrate structure includes providing an insulating surface which includes a pattern forming portion. An activation ink is deposited only on the pattern forming portion to form a non-conductive isolation layer. A first metal layer is formed on the non-conductive isolation layer by electroless plating. A patterned portion of the first metal layer is isolated from a remaining portion of the first metal layer to form the circuit pattern. A non-conductive masking layer is applied on the first metal layer. A second metal layer is formed on the non-conductive masking layer. A surface mount land pattern and pad configuration is determined. A solder mask layer is applied to the patterned portion. A protective layer is applied to protect pad areas not covered by the solder mask layer. An electrical component may then be mounted to the pad(s).

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.