A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. Trace channels and apertures are formed into the catalytic laminate, electroless plated with a metal such as copper, filled with a conductive paste containing metallic particles, which are then melted to form traces. In a variation, multiple circuit board layers have channels formed into the surface below the exclusion depth, apertures formed, are electroless plated, and the channels and apertures filled with metal particles. Several such catalytic laminate layers are placed together and pressed together under elevated temperature until the catalytic laminate layers laminate together and metal particles form into traces for a multi-layer circuit board.

A plated plated fiber-reinforced member includes: a fiber-reinforced member formed of a composite fiber material in which multiple reinforcing fibers dispersed in a resin, some of the multiple reinforcing fibers being allowed so that portions thereof protruding from a surface of the resin; and an electroless-plated layer formed on the fiber-reinforced member to cover the surface of the resin and the portions of the reinforcing fibers protruded from the surface of the resin.

An airfoil is disclosed. The airfoil may comprise a leading edge, a body portion and a trailing edge formed from a high-modulus plating. The body portion of the airfoil may be formed from a material having a lower elastic modulus than the high-modulus plating. The high-modulus plating may improve the stiffness of the trailing edge, allowing for thinner trailing edges with improved fatigue life to be formed.

An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

A composite component and a plated polymer component are disclosed. The composite component may comprise a body portion formed from an organic matrix composite, a first metal coating applied to a surface of the body portion, and an outer metal layer on the first metal coating that is erosion-resistant. The plated polymer component may comprise a polymer substrate, a metal plating layer applied to a surface of the polymer substrate, and at least one selectively thickened region in the metal plating layer. The at least one selectively thickened region may assist in protecting the plated polymer component against wear and/or erosion.

A fuel tank for use with a spacecraft, the fuel tank being configured to store therein fuel for driving the spacecraft, includes a carbon fiber reinforced plastic layer and a metallic plating layer, the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, and the metallic plating layer is provided on the polished surface.

An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

A component is provided including a body formed at least partially from a composite material. At least a portion of the composite material is covered by a plating. The plating includes a layer of electroless copper, a layer of electrolytic copper, a layer of nickel strike, and a finishing layer.

Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.