A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.

The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.

A multilayer curable resin film comprising a first resin layer comprising a first curable resin composition including a polyphenylene ether oligomer (A1) with an end modified by an aromatic vinyl group and a curing agent (A2) and a second resin layer comprising a second curable resin composition including an alicyclic olefin polymer (B1) and a curing agent (B2), a prepreg comprised of this including a fiber substrate, and a laminate, cured product, composite, and multilayer circuit board obtained using these are provided.

Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]

It is provided a method for manufacturing a metal coated substrate by forming a metal coating on a surface of a substrate, comprising: immersing the substrate in a palladium/tin colloidal solution; immersing the substrate in an acid solution; carrying out electroless metal plating in order to obtain a continuous film-coated substrate, and subjecting the metal coating to a cryogenic treatment step in order to make it permeable to electromagnetic waves, the cryogenic treatment step being carried out by cooling the substrate with liquid nitrogen. It is also provided a metal coated substrate obtainable by the mentioned method and an article of manufacture made of the metal coated substrate.

It is provided a method for manufacturing a metal coated substrate by forming a metal coating on a surface of a substrate, comprising: immersing the substrate in a palladium/tin colloidal solution; immersing the substrate in an acid solution; carrying out electroless metal plating in order to obtain a continuous film-coated substrate, and subjecting the metal coating to a cryogenic treatment step in order to make it permeable to electromagnetic waves, the cryogenic treatment step being carried out by cooling the substrate with liquid nitrogen. It is also provided a metal coated substrate obtainable by the mentioned method and an article of manufacture made of the metal coated substrate.