Patent classifications
C04B2235/383
CERAMIC DEVICES AND METHODS OF MAKING AND USING THE SAME
The present invention relates to methods for preparing ceramic devices having a surface that has been activated to enhance properties including strength, porosity, and bioactivity. Activation may include forming a gel layer on the surface of a ceramic device using an alkali solution and modifying the surface using a modifying material. The invention further relates to ceramic devices prepared by the methods and methods of using the devices.
Method of producing SiC—Si composite component and SiC—Si composite component
The present invention relates to a method of producing a SiCSi composite component. The method includes preparing a first molded body containing SiC particles by a 3D printing method, wherein the first molded body has a first average pore diameter M.sub.1; forming a second molded body, in which the first molded body and a dispersion containing carbon particles are brought into contact so that the pores are impregnated with the carbon particles, wherein the carbon particles have a secondary particle having an average particle diameter M.sub.2, and the carbon particles satisfy the following formula:
M.sub.2M.sub.1/10; and forming a SiCSi composite component by carrying out that the second molded body is impregnated with a metallic si and is reactively sintered; wherein the content of Si is in the range of 5% by mass to 40% by mass in the SiCSi composite component.
Armor plating made of fine-grain boron carbide and silicon carbide
An antiballistic armor-plating component, includes a ceramic body made of a material comprising, as percentages by volume, between 35% and 55% of silicon carbide, between 20% and 50% of boron carbide, between 15% and 35% of a metallic silicon phase or of a metallic phase including silicon.
Laminated member
The present invention relates to a laminated member including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer including a resin and lying on the glass member; and a SiSiC member lying on the bonding member, in which the SiSiC member has an average linear expansion coefficient at from 20 C. to 200 C. of from 2.85 ppm/ C. to 4.00 ppm/ C.