An object which the present invention is to achieve is to provide a urethane composition capable of providing a molded product having excellent heat resistance and high hardness. The present invention is to provide a urethane composition containing a main agent (i) including a urethane prepolymer having an isocyanate group obtained by allowing a polyol (A) and a polyisocyanate (B) to react with each other, and a curing agent (ii), in which the polyol (A) includes a polyether polyol (a1) obtained by polymerizing an aromatic compound (a1-1) having two or more active hydrogen atom-containing groups and an alkylene oxide (a1-2), and a polishing material obtained by curing the urethane composition with heat, followed by slicing.

An object which the present invention is to achieve is to provide a urethane composition capable of providing a molded product having excellent heat resistance and high hardness. The present invention is to provide a urethane composition containing a main agent (i) including a urethane prepolymer having an isocyanate group obtained by allowing a polyol (A) and a polyisocyanate (B) to react with each other, and a curing agent (ii), in which the polyol (A) includes a polyether polyol (a1) obtained by polymerizing an aromatic compound (a1-1) having two or more active hydrogen atom-containing groups and an alkylene oxide (a1-2), and a polishing material obtained by curing the urethane composition with heat, followed by slicing.

The present invention addresses the issue of providing a cleaning blade having excellent durability. An elastic body for blades is provided that has an abutting section that comprises a heat-curable polyurethane urea that is a reaction product of at least a polyol, a polyisocyanate, and a curing agent including a diaminobenzoic acid ester indicated by general formula (1).

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The present invention addresses the issue of providing a cleaning blade having excellent durability. An elastic body for blades is provided that has an abutting section that comprises a heat-curable polyurethane urea that is a reaction product of at least a polyol, a polyisocyanate, and a curing agent including a diaminobenzoic acid ester indicated by general formula (1).

##STR00001##

In the composition according to an embodiment, the weight ratio of toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate in the urethane-based prepolymer is adjusted, whereby such physical properties as gelation time can be controlled. Thus, the polishing rate and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled while it has a hardness suitable for a soft pad, whereby it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

In the composition according to an embodiment, the weight ratio of toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate in the urethane-based prepolymer is adjusted, whereby such physical properties as gelation time can be controlled. Thus, the polishing rate and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled while it has a hardness suitable for a soft pad, whereby it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

Provided are a polymer having a constituent component represented by formula (I) below, a method for producing the polymer, a diamine compound suitable as a raw material for the polymer, a gas separation membrane haying a gas separation layer including the polymer, and a gas separation module and a gas separation apparatus that have the gas separation membrane.

##STR00001##

In the formula (I), R.sup.A, R.sup.B, and R.sup.C represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom. Herein, at least one of R.sup.A, R.sup.B, or R.sup.C represents an alkyl group having 1 to 4 carbon atoms or a halogen atom. The alkyl group having 1 to 4 carbon atoms is not trifluoromethyl and ** represents linking sites.

The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad. The polishing pad increases the area in direct contact with the semiconductor substrate during the polishing process and can prevent defects occurring on the surface of the semiconductor substrate by forming a plurality of uniform pores in the polishing layer, thereby adjusting the surface roughness characteristics of the polishing surface of the polishing layer. Further, the present disclosure may provide a method for manufacturing a semiconductor device to which the polishing pad is applied.

The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad. The polishing pad increases the area in direct contact with the semiconductor substrate during the polishing process and can prevent defects occurring on the surface of the semiconductor substrate by forming a plurality of uniform pores in the polishing layer, thereby adjusting the surface roughness characteristics of the polishing surface of the polishing layer. Further, the present disclosure may provide a method for manufacturing a semiconductor device to which the polishing pad is applied.

Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.