An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

The present invention relates to an electrically conductive polyurethane composite material and a method for producing same and can be used in the manufacture of articles and coatings from polyurethane composite materials having a desired electrical conductivity. The present method for producing an electrically conductive polyurethane composite material by reacting organic polyisocyanates (A) with one or more compounds (B) containing NCO-reactive groups includes a step of mixing a concentrate of carbon nanotubes with compounds (B) or with polyisocyanates (A) or with a mixture containing organic polyisocyanates (A) and compounds (B) at an input energy of less than 0.5 kW.Math.h per 1 kg of mixture and a carbon nanotube content of less than 0.1 mass. % relative to the sum of the masses of (A) and (B).

The present invention relates to an electrically conductive polyurethane composite material and a method for producing same and can be used in the manufacture of articles and coatings from polyurethane composite materials having a desired electrical conductivity. The present method for producing an electrically conductive polyurethane composite material by reacting organic polyisocyanates (A) with one or more compounds (B) containing NCO-reactive groups includes a step of mixing a concentrate of carbon nanotubes with compounds (B) or with polyisocyanates (A) or with a mixture containing organic polyisocyanates (A) and compounds (B) at an input energy of less than 0.5 kW.Math.h per 1 kg of mixture and a carbon nanotube content of less than 0.1 mass. % relative to the sum of the masses of (A) and (B).

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.

Golf balls having covers made of thermoplastic polyurethane compositions are provided. Multi-piece golf balls can be made. The outer cover layer is formed from a composition comprising a thermoplastic polyurethane, a multi-functional hydroxyl compound, and a multi-functional compound selected from multi-functional amines and imines, and multi-functional isocyanates, and mixtures of two or more thereof. The cover composition can further include catalysts, ultraviolet (UV)-light stabilizers, and other additives.

The present disclosure provides a composition for manufacturing a polyurethane polishing pad. The composition includes 15 to 25 wt % of MBCA, 25 to 45 wt % of isocyanates, 15 to 45 wt % of polyols, 5 to 35 wt % of EOPO, and 1 to 5 wt % of additives. The polyurethane polishing pad made from the composition of the present disclosure has a hardness within a range of 40 to 70 shore D, an elongation within a range of 200 to 400%, a density within a range of 0.7 to 0.9 g/cc, a modulus within a range of 25000 to 40000 kg/cm.sup.2, and a tensile stress within a range of 120 to 320 kg/cm.sup.2.

Degradable polymers, including polyurethane and polyurethane-urea compositions, that can be used in aqueous, non-aqueous and dry hot environments as degradable polymers in oil, gas and other applications.

Degradable polymers, including polyurethane and polyurethane-urea compositions, that can be used in aqueous, non-aqueous and dry hot environments as degradable polymers in oil, gas and other applications.