Patent classifications
C08G18/6438
Dispersants with multiple aromatic imide anchor groups
Polymeric dispersants are disclosed that include a urethane backbone at least one pendantly attached imide group, wherein the carbonyl of the imide are chemically bonded to a single or fused aromatic ring. The aromatic ring can be substituted with various electron withdrawing or releasing groups. The dispersant also includes solvent-solubilizing chains of polyether, polyester, polyacrylate, and or polyolefin Desirably, the imide groups are derived from an imide that has two isocyanate reactive groups such that the imide is attached to the urethane backbone at two separate locations.
POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE
A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.
Highly-selective polyimide membranes with increased permeance, said membranes consisting of block copolyimides
The present invention relates to novel block copolyimides for preparing highly selective integrally asymmetrical gas separation membranes of improved permeance, processes for preparing these block copolyimides, membranes prepared from the block copolyimides, and also the use of the block copolyimides and of the membranes prepared therefrom.
Poly(amide-imide) copolymer, method of manufacturing the same, poly(amide-imide) copolymer film, window for display device, and display device
A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.
Resin composition, insulating matrix comprising the same and circuit board using the same
A resin composition, an insulating matrix comprising the same and a circuit board using the same. The resin composition of the present invention comprises: a cross-linked polymer formed by a diamine unit containing an imide group, which is represented by the following formula (1), and an isocyanate unit represented by the following formula (2):
##STR00001## wherein, R.sub.1, R.sub.2, A, X and a are defined in the specification.
IMIDE-CONTAINING POLYOLS, METHODS FOR MAKING IMIDE-CONTAINING POLYOLS AND METHODS FOR USING IMIDE-CONTAINING POLYOLS
Embodiments of the present disclosure are directed towards imide-containing polyols, methods for making imide-containing polyols, and methods for using imide-containing polyols.