(A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10 C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150 C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100 C., or a polyamide resin having a -type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

The waterborne amino baking varnish is prepared with raw materials in percent by weight comprising: 25-40% of a waterborne polyurethane, 4-5% of a waterborne epoxy resin, 7-10% of a waterborne amino resin, 25-35% of deionized water, 1.5-2.5% of a pH regulator, 0.3-0.5% of a wetting agent, 0.2-0.6% of a defoamer, 0.5-1% of a dispersant, 1-5% of a cosolvent, 10-20% of a pigment and a filler, 2-5% of nano-alumina, 0.3-0.5% of lithium magnesium silicate, 0.3-0.5% of a thickener, and 0.5-0.8% of a leveling agent.

(A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10 C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150 C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100 C., or a polyamide resin having a -type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

The invention provides a unique thermoset viscoelastomeric reaction product and a container combination comprised of the supportive base equipped with a thermoset viscoelastomer reaction product possessing unexpectedly superior adhesive and cohesive efficacy rendering it especially useful as an adhesive insert in a container combination. The thermoset insert bonds to any suitable supportive structure. The unique viscoelastomeric reaction product inserts adhesively immobilize items placed thereupon and adhesively or permanently bonds to most conventional containers. The tenacious cohesive and adhesive features of the insert allows for inverted stowage of stowed items. Due to the confining adhesive and cohesive attributes of the insert, structural supports of a flexible or solid base without a conventional confining structure provide a unique container combination for the stowed items. Containers equipped with the unique insert also surprisingly provide an aseptic environment especially useful for hygienic applications.

The present invention provides a polyorganosiloxane compound having a low viscosity, a process for the manufacture of such polyorganosiloxane compounds, polyorganosiloxane compositions comprising said polyorganosiloxane compound and another polyorganosiloxane compound which is different from the polyorganosiloxane compound, aqueous emulsions comprising the polyorganosiloxane compound, and a method of surface treatment using the polyorganosiloxane compound.

Presently described are curable compounds and curable compositions. Thermosets including the curable compounds and curable compositions described herein are derived from bio-based components and have improved mechanical properties. The described compositions can also be applicable to rosin derivatives and fatty acid derivatives.

(A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10 C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150 C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100 C., or a polyamide resin having a -type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

The invention relates to a binder resin which is a plastified epoxide-amine adduct P comprising an adduct EA made of epoxide resins E and amines A, optionally modified by incorporation of unsaturated fatty acids F, which adduct is plastified by incorporation of a fatty acid amide M, or a mixture M of the said fatty acid amide M with a glyceride mixture GX which is a mixture of at least two glycerides selected from the group consisting of a triglyceride GT, a diglyceride GD, and a monoglyceride GM, to a process for its preparation, and to a method of use thereof as primer for wood, mineral, and metal substrates.

The present invention provides a polyorganosiloxane compound having a low viscosity, a process for the manufacture of such polyorganosiloxane compounds, polyorganosiloxane compositions comprising said polyorganosiloxane compound and another polyorganosiloxane compound which is different from the polyorganosiloxane compound, aqueous emulsions comprising the polyorganosiloxane compound, and a method of surface treatment using the polyorganosiloxane compound.

A two-component curable composition includes: a liquid A containing an epoxy compound having two epoxy groups and having at least one selected from the group consisting of a divalent aliphatic hydrocarbon group and a polyether structure between the two epoxy groups, a reactive diluent, and a thermally conductive filler; and a liquid B containing an amine compound, a plasticizer, and a thermally conductive filler.