A shape-memory epoxy polymer graphene foam composite (SMEP-GrF) is formed from an open cell graphene foam (GrF) surrounded by and infiltrated with a shape-memory epoxy polymer (SMEP) matrix, with the GrF being an intra-connected framework within the SMEP matrix. The SMEP-GrF provides self-healing properties to a device fabricated from the SMEP-GrF. The SMEP-GrF is formed by infusion of an epoxy resin and hardener in an open cell GrF and curing the infused GrF.

The present invention relates to an amine-based curing agent comprising at least 1% by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine tertiary amine and, more preferably, N-hydroxyethyl piperidine (NHEP). The present invention also relates to an epoxy resin composition formed using this amine-based curing agent and a method of making the epoxy resin composition. These tertiary amines enhance desirable properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with tertiary amine-based curing agents.

The present invention relates to a liquid crystal aligning agent composition capable of securing a high imidization rate under relatively mild curing conditions, minimizing side reactions and thus having excellent stability, a method for producing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same.

This base proliferating agent is represented by formula (1) or (2), where, in formula (1) and (2), R1, R2, and R3 independently represent a hydrogen atom or a substituent and n independently represents an integer from 1 to 4. A base-reactive resin composition can include this base proliferating agent and a base-reactive compound. ##STR00001##

The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I)

##STR00001## in which R.sup.1 to R.sup.4 is H or an organic radical, with the proviso that at least one of the R.sup.1, R.sup.2, R.sup.3 and R.sup.4 radicals H, and

X(Y.sup.1).sub.m-(A.sup.1).sub.n-(Y.sup.2).sub.o-(A.sup.2).sub.p-(Y.sup.3).sub.q-(A.sup.3).sub.r-(Y.sup.4).sub.s(II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A.sup.1, A.sup.2, A.sup.3=alkylene or alkenylene radical and Y.sup.1, Y.sup.2, Y.sup.3, Y.sup.4NR.sup.5, PR.sup.5, O or S, where R.sup.5 independently=organic radical, where any two organic radicals selected from R.sup.1 to R.sup.5 and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R.sup.1 to R.sup.5 present and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 is substituted by at least one NHR.sup.6 or NH.sub.2 group, where R.sup.6=organic radical, and c) at least one salt of a strong Brnsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions, where the ratio of the epoxy groups in the epoxy resin to the sum total of all NH groups in all amines is 0.5:1 to 1.5:1, and to processes for production thereof and use thereof.

The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brnsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.

The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I)

##STR00001## in which R.sup.1 to R.sup.4 is H or an organic radical and

X(Y.sup.1).sub.m-(A.sup.1).sub.n-(Y.sup.2).sub.o-(A.sup.2).sub.p-(Y.sup.3).sub.q-(A.sup.3).sub.r-(Y.sup.4).sub.s, (II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A.sup.1, A.sup.2, A.sup.3=alkylene or alkenylene radical and Y.sup.1, Y.sup.2, Y.sup.3, Y.sup.4=NR.sup.5, PR.sup.5, O or S, where R.sup.5 independently=organic radical, where any two organic radicals selected from R.sup.1 to R.sup.5 and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R.sup.1 to R.sup.5 present and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 is substituted by at least one NHR.sup.6 or NH.sub.2 group, where R.sup.6=organic radical, and c) at least one salt of a very strong Brnsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions, and to processes for production thereof and use thereof.

The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brosted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.

A low-loss insulating resin composition and an insulating film using the same are provided. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.

A curing agent or a curing accelerator which is easy to synthesize and may cure an epoxy resin and the like, or may accelerate the curing is provided. A curing agent or a curing accelerator according to some embodiments of the present invention has a highly-coordinated silicon structure.