The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. ##STR00001##
(In the Formula (1), R.sup.1 to R.sup.6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.)

The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. % of a) at least one oxetane compound according to Formula (1) below:

##STR00001## wherein: R.sup.1 and R.sup.2 are H, C.sub.1-C.sub.6 alkyl, C.sub.6-C.sub.18 aryl or C.sub.7-C.sub.18 aralkyl; each R.sup.3 is independently a C.sub.1-C.sub.12 alkylene group, C.sub.6-C.sub.18 arylene group, C.sub.2-C.sub.12 alkenylene group or a poly(C.sub.1-C.sub.6 alkyleneoxy) group; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt % of c) at least one ionic photoacid generator; from 0 to 10 wt. % of d) at least one free radical photoinitiator; from 0.01 to 5 wt. % of e) at least one near-infrared absorbing dye; and, from 50 to 90 wt. % of f) particulate filler.

An inkjet printing method and inkjet compositions are disclosed. The method includes selectively depositing by inkjet printing, layer by layer, a first composition and a second composition onto a receiving media from different dispensers to form polymerizable deposited layers. The first composition includes one or more free-radical polymerizable compounds and a cationic photoinitiator and is devoid of compounds able to undergo cationic photopolymerization within the first composition. The second composition includes one or more cationic polymerizable compounds and is devoid of cationic photoinitiators. At least one of the compositions includes a radical photoinitiator. The method further includes exposing the deposited layers to actinic radiation to initiate polymerization of the free-radical polymerizable compounds and the cationic polymerizable compounds within the deposited layers.

The present application relates to an encapsulating composition, an organic electronic device, a method for evaluating reliability of the organic electronic device and a method for preparing the organic electronic device, and provides an encapsulating composition which can improve flatness and adhesion of an organic layer sealing an organic electronic element to effectively block moisture or oxygen introduced into an organic electronic device from the outside, thereby securing the lifetime of the organic electronic device.

Supported onium salts used as initiators for the synthesis of polycarbonates by copolymerization of carbon dioxide with epoxides are described. Embodiments of the present disclosure describe initiators comprising an insoluble portion including an onium cation attached to an insoluble support; and an anion, wherein the anion is a counter-ion to the onium cation. Embodiments further describe methods of making polycarbonates using the initiator, methods of making initiators, and the like.

Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a) having a chain hydrocarbon skeleton, a divinyl ether compound (a-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.

The invention relates to a process for free radical-induced cationic frontal polymerization of cationically polymerizable monomers using a combination of at least one cationic polymerization initiator and at least one activator for said at least one initiator, characterized in that benzopinacol is used as said activator.

The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.

The present application relates to an encapsulating composition, an organic electronic device, a method for evaluating reliability of the organic electronic device and a method for preparing the organic electronic device, and provides an encapsulating composition which can improve flatness and adhesion of an organic layer sealing an organic electronic element to effectively block moisture or oxygen introduced into an organic electronic device from the outside, thereby securing the lifetime of the organic electronic device.