The present invention relates to a modified polyimide including a terminal group represented by Formula 1:

##STR00001## wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

The present specification relates to a polyimide resin, a positive-type photosensitive resin composition, an insulating film and a semiconductor device.

Method for preparing porous polyurethane materials with controlled pore size and shape using isocyanates, polyols, and additives, and the porous polyurethane materials prepared therefrom. Method for preparing porous polyimides using at least one polyamine and a dianhydride and the porous polyimides materials prepared therefrom. The porous materials are useful for energy management, such as thermal, impact and vibration energy, and can exhibit improved fire-resistant performance.

The present invention provides two-dimensional polymers P1 and P2 of pyromellitic diimide and hexaamino benzene and derivatives thereof, from monomer of Formula (M), which are used to synthesize composites for supercapacitor applications. M

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.

A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a functionalized polyetherimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride, a substituted or unsubstituted C.sub.1-40 organic diamine, and optionally an organic compound, wherein the functionalized polyetherimide includes a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyetherimide has a total reactive end group concentration of 50-1,500 μeq/g and 0.05-1,000 ppm by weight of residual organic diamine, wherein the functionalized polyetherimide is obtained by precipitation from a solution using an organic anti-solvent, or by devolatilization, and the organic compound comprises at least two functional groups/molecule.

A benzocyclobutene-containing polyimide resin and a benzocyclobutene-containing polyimide resin composition are provided. The composition includes: (a) a filler: hollow silica, a perfluoroalkoxy alkane resin, or a combination thereof, and (b) a benzocyclobutene-containing polyimide resin with characteristics of high heat resistance, low dielectric property, low elastic modulus, and suitable for manufacturing a redistribution layer and a polyamide film of a semiconductor packaging material in a high-speed and high-frequency field.

A polyimide resin composition containing a polyimide resin (A) and a nanocarbon material (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %: wherein R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic group.

##STR00001##

A resin composition containing a liquid crystal polymer (A) and a predetermined polyimide resin (B), wherein the liquid crystal polymer (A) contains at least one repeating structural unit selected from the group consisting of repeating structural units represented by the following formulas (I) to (IV), and a molded article containing the same:

##STR00001##

wherein a, b, and c represent an average number of repeating structural units.