A polyester film comprising a polymeric phosphonate flame retardant in an amount of from about 1.0 to about 25.0 wt % by total weight of the film and further comprising at least one metal cation selected from the group consisting of Group I and Group II metal cations.

Provided herein are coated substrates. Also provided herein are methods for attaching phosphonates, phosphonic acids, or derivatives thereof to an organic or an inorganic substrate (e.g., a metal oxide substrate) via phosphonate chemistry to form the coated substrates provided herein.

Provided herein are coated substrates. Also provided herein are methods for attaching phosphonates, phosphonic acids, or derivatives thereof to an organic or an inorganic substrate (e.g., a metal oxide substrate) via phosphonate chemistry to form the coated substrates provided herein.

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

The liquid composition for optical filters according to the present invention contains: a light absorber; at least one of an alkoxysilane and a hydrolysate of an alkoxysilane; a phosphoric acid ester; and a solvent. The light absorber is formed by a phosphonic acid having an aryl group bonded to a phosphorus atom and copper ion. In the liquid composition, a content of an organic solvent having a relative permittivity of 7 or less at 20° C. is 50 mass % or less.

The liquid composition for optical filters according to the present invention contains: a light absorber; at least one of an alkoxysilane and a hydrolysate of an alkoxysilane; a phosphoric acid ester; and a solvent. The light absorber is formed by a phosphonic acid having an aryl group bonded to a phosphorus atom and copper ion. In the liquid composition, a content of an organic solvent having a relative permittivity of 7 or less at 20° C. is 50 mass % or less.

A wood plastic composite comprises a thermoplastic resin, a lignocellulosic filler, a flame retardant material in an amount of between 10 to 20 percent by weight, based on the total weight of the composite, and optionally other additives, wherein the flame retardant material comprises one or more compounds selected from the group of a cyclic organophosphorous compound and mixtures of the cyclic organophosphorous compound together with a nitrogen-containing organic compound, and optionally a minor amount of an inorganic flame retardant.

A wood plastic composite comprises a thermoplastic resin, a lignocellulosic filler, a flame retardant material in an amount of between 10 to 20 percent by weight, based on the total weight of the composite, and optionally other additives, wherein the flame retardant material comprises one or more compounds selected from the group of a cyclic organophosphorous compound and mixtures of the cyclic organophosphorous compound together with a nitrogen-containing organic compound, and optionally a minor amount of an inorganic flame retardant.