The multi-layer metal article (10) includes a metal base (12) formed from a first metal and at least one interlayer (14) formed on an upper surface (18) of the metal base (12). The at least one interlayer (14) is formed from a second metal having a greater hardness than a hardness of the first metal, thus increasing the hardness of the overall multi-layer metal article (10) when compared against the hardness of just the metal base (12). An outer coating layer (16) may then be coated on an upper surface (20) of the at least one interlayer (14). As a non-limiting example, the outer coating layer (16) may be a scratch-resistant material, thus increasing both the hardness and scratch resistance of the overall multi-layer metal article (10) when compared against those of just the metal base (12). The outer coating layer (16) may be transparent, partially transparent or opaque.

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

A thermosetting resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is a thermosetting resin, and component (B), which is core-shell-type elastomer particles.

A film-forming apparatus is connected to a carbon steel cleanup system pipe of a BWR plant. Formic acid and hydrogen peroxide are injected into the circulation pipe of the film-forming apparatus. An iron elution accelerator aqueous solution containing 3000 ppm of formic acid and 1500 ppm of hydrogen peroxide is brought into contact with the inner surface of the cleanup system pipe, and Fe2+ is eluted from the cleanup system pipe by formic acid, and hydroxyl radicals generated from hydrogen peroxide. The film-forming aqueous solution produced from the iron elution accelerator aqueous solution by injecting the nickel formate aqueous solution is brought into contact with the inner surface of the cleanup system pipe, and the Ni ions incorporated into the inner surface by the substitution reaction are reduced by the electrons generated at the time of elution of Fe2+ to form a Ni metal film on the inner surface thereof.

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form aesthetic injection-molded articles. The polyamide compositions may include from 45 wt. % to 75 wt. % of an polyamide, from 2 wt. % to 40 wt. % of an etchable filler, from 10 wt. % to 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance to injection-molded articles that are substantially free of visual defects.

A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.

Provided is a metal material and a connection terminal that have a surface layer including Au, and that can maintain a state of low contact resistance even when heated. A metal material 1 includes a base material 10 and a surface layer 11 formed on the base material 10. The surface layer 11 contains Au and In, and at least In is present at an outermost surface. Also, a connection terminal is constituted by the metal material 1, and the surface layer 11 is formed on a surface of the base material 10 at least at a contact portion that comes into electrical contact with a partner conductive member.

A metal-plated carbon material includes: a carbon material; and a metal layer covering a surface of the carbon material, in which, in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. A method of manufacturing a metal-plated carbon material, includes: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal.

The invention relates to selective deposition of a nickel layer on a copper surface. The invention may be used in the production of electrically conductive areas for electronic circuits. Method for nickel deposition on the surface of copper comprises immersing an item, which surface is to be deposited with the nickel layer, into one or more baths, of which at least one contains a reducing agent and of which at least one is adapted for (electroless) plating of nickel. In order to extend the field of application and to obtain practically pure nickel coatings, said reducing agent comprises boronic or phosphoric compounds, comprising morpholine borane (C.sub.4H.sub.9BNO), or dimethylamine borane (C.sub.2H.sub.7BN), or sodium tetrahydroborate (NaBH.sub.4), or sodium hypophosphite (NaH.sub.2PO.sub.2) and said reducing agent directly or indirectly reduces insoluble copper (I) or copper (II) compounds on the copper surface. At least one of the mention baths comprises a ligand or mixture thereof.