A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

A method for forming a self-forming barrier in a feature of a substrate is provided, including the following operations: depositing a metallic liner in the feature of the substrate, the metallic liner being deposited over a dielectric of the substrate; depositing a zinc-containing precursor over the metallic liner; performing a thermal soak of the substrate; repeating the depositing of the zinc-containing precursor and the thermal soak of the substrate for a predefined number of cycles; wherein the method forms a zinc-containing barrier layer at an interface between the metallic liner and the dielectric.

A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.

A process for creating a hybrid network of fibers comprises depositing a first polymer mixture (or solution) including a electroless plating initiator onto a collector. Simultaneously, a second polymer mixture (or solution) is deposited onto the collector while the first polymer mixture is being deposited. The second polymer mixture is not doped with a metal. A rate at which the first polymer mixture is deposited and a rate at which the second polymer mixture is deposited are controlled to control a ratio of metal-doped fibers and non-metal-doped fibers in a resulting hybrid network of fibers. The metal-doped fibers are created from the first polymer mixture and the non-metal-doped fibers are created from the second polymer mixture. After the fibers have been created, deposition of both the first polymer mixture and the second polymer mixture is stopped. The metal-doped fibers are metalized with a metal using electroless plating.

Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology. Nano-scale channels structures are etched, so that the super-hydrophobic inner surface can have a better ability to store air, and its water flow impact resistance is greatly enhanced.

There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

A method of providing a metallically reflective surface on a substrate includes applying a primer layer to the substrate, mixing a solution of silver salt with a reducing agent and spraying the solution onto the primer layer to form a silver layer, and applying at least one transparent or translucent top coat layer or at least one clear coat layer onto the silver layer, wherein the primer contains a corrosion inhibitor selected from the group consisting of benzotriazole, tolyltriazole, benzimidazole, derivatives of the compounds and mixtures of two or more of the compounds and/or derivatives.

The present invention provides a surface-independent surface-modifying multifunctional biocoating and methods of application thereof. The method comprises contacting at least a portion of a substrate with an alkaline solution comprising a surface-modifying agent (SMA) such as dopamine so as to modify the substrate surface to include at least one reactive moiety. In another version of the invention, a secondary reactive moiety is applied to the SMA-treated substrate to yield a surface-modified substrate having a specific functionality.

A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.

There is provided a gold plate coated stainless material characterized by comprising: a stainless steel sheet formed with a passivation film having a surface of which a Cr/O value is within a range of 0.05 to 0.2 and a Cr/Fe value is within a range of 0.5 to 0.8 when measured by Auger electron spectroscopy analysis; and a gold plated layer formed on the passivation film of the stainless steel sheet. According to the present invention, there can be provided a gold plate coated stainless material which can be improved in the coverage and interfacial adhesion property of the gold plated layer formed on the stainless steel sheet even when reducing the thickness of the gold plated layer, thereby to be excellent in corrosion resistance and conductivity and advantageous in cost.