The present invention provides a surface-independent surface-modifying multifunctional biocoating and methods of application thereof. The method comprises contacting at least a portion of a substrate with an alkaline solution comprising a surface-modifying agent (SMA) such as dopamine so as to modify the substrate surface to include at least one reactive moiety. In another version of the invention, a secondary reactive moiety is applied to the SMA-treated substrate to yield a surface-modified substrate having a specific functionality.

A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.

A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.

Disclosed herein is a structure for strengthening strength and a method of manufacturing the same, and more particularly to a structure for strengthening strength in which a coating layer made of material containing tungsten is formed on the surface of a base of a base metal or a bass of a metal base. According to the present invention, it is possible to substitute synthetic resins and metal products which are currently manufactured and used, exhibit excellent physical properties and mechanical properties as compared with those of synthetic resins and metal products. And also if necessary, the surface of the metal plating of the structure according to the present invention may be plated with various precious metals such as gold and silver to meet the demand of the customer.

Methods for forming thin, pinhole-free conformal metal layers on both conducting and non-conducting surfaces, where the morphology and properties of the metal layers are tuned to meet desired parameters by adjusting the concentration of ionic liquids during the deposition process. The formed metal films contain tunable properties for solar and electronic use and provide specific advantages for non-conducting surfaces, which are otherwise unsuitable for electroplating without the presence of the formed metal films. The disclosed methods do not require the presence of a voltage or external electric field but form the metal films through an electroless technique using electrostatic interactions between negatively charged nanoparticles. In addition, the disclosed methods are compatible with solution phase processing and eliminate the need to transfer the surfaces into a vacuum chamber for a chemical or physical vapor deposition to form a metal layer.

A plating method includes: providing a work piece which is metal or non-metal; forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece.

Provided is a silver-coated copper powder that has a dendritic shape, that ensures excellent conductivity as a result of having an increased number of points of contact when silver-coated dendritic copper particles are in contact, prevents aggregation, and that can be suitably used in a conductive paste, and an electromagnetic wave shield. The silver-coated copper powder comprises amassed dendritic copper particles having a linearly grown main trunk and a plurality of branches branching from the main trunk. The surface of the copper particles is coated with silver. The main trunk and the branches of the copper particles have a flat plate shape in which the average cross-sectional thickness is more than 1.0 m but no more than 5.0 m. The silver-coated copper powder has a flat plate shape configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 m.

A method for manufacturing a heat exchanger including forming a heat exchanger with walls using direct metal laser melting. The walls include defects formed during the direct metal laser melting process. The defects can cause leaking within the heat exchanger. The method includes healing the defects.

A multilayer metal-matrix composite that includes a metal core sheet and a plurality of side sheets is disclosed in which the metal core sheet is reinforced with a reinforcement material selected from the group consisting of ceramic reinforcements. The reinforced metal core sheet is coated with an electroless coating. A method of fabricating a multilayer metal-matrix composite with reinforced particles and a coating using a combination of electroless coating method and accumulative roll bonding method is further described in this disclosure with the aim of reducing the number of required accumulative roll bonding cycles to obtain improved or desired properties.

A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.