A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition.

According to one embodiment, a heat radiating plate-lined ceramic substrate includes a first bonding layer, a plating layer and a heat radiating plate provided in order on the ceramic substrate. The first bonding layer is formed from a molecular bonding material containing a ceramic substrate fixing portion and a plating support portion. The ceramic substrate fixing portion and the first bonding layer are bonded together by the ceramic substrate fixing portion and the plating layer and the first bonding layer are bonded together by the plating support portion.

In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.

A method of forming a copper metal layer on a non-metallic material contains: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution. Thereby, the copper metal layer is formed on the carbon-based electroless-plating inks of the non-metallic material.

A method for forming a metal wiring according to embodiments includes forming a first insulating layer on a substrate; forming a catalyst adsorption layer by bringing a surface of the first insulating layer into contact with a solution containing a compound having a triazine skeleton, a first functional group of one of a silanol group and an alkoxysilyl group, and a second functional group of at least one selected from the group consisting of an amino group, a thiol group, a carboxyl group, and an azide group; forming a second insulating layer different from the first insulating layer on the catalyst adsorption layer; patterning the second insulating layer to form a mask pattern; etching the first insulating layer by a wet etching method; selectively forming a catalyst layer; and forming a metal layer on the catalyst layer by an electroless plating method.

A method for fabrication of selectively deposited electroless copper metallization on a photo-definable glass substrate. The electroless copper can metallize a two-dimensional or three-dimensional structure on the photo-definable glass to connect or isolate passive or active devices. The electroless copper metallization can also coat the side walls of aspect ratio blind or through hole via.

A method for forming a metal wiring according to embodiments includes forming a first insulating layer on a substrate; forming a catalyst adsorption layer by bringing a surface of the first insulating layer into contact with a solution containing a compound having a triazine skeleton, a first functional group of one of a silanol group and an alkoxysilyl group, and a second functional group of at least one selected from the group consisting of an amino group, a thiol group, a carboxyl group, and an azide group; forming a second insulating layer different from the first insulating layer on the catalyst adsorption layer; patterning the second insulating layer to form a mask pattern; etching the first insulating layer by a wet etching method; selectively forming a catalyst layer; and forming a metal layer on the catalyst layer by an electroless plating method.

Methods of forming a structural color metal-dielectric-metal (MDM) component via a solution-based process are provided. First, a first metal layer is formed over a treated surface of a substrate by a first electroless deposition process. A surface of the treated substrate is contacted with a first plating bath that comprises a metal selected from the group consisting of: copper, aluminum, silver, alloys, and combinations thereof. A dielectric layer, for example, comprising silicon dioxide, is then deposited over the first metal layer by a sol-gel process. Next, the method comprises forming a second metal layer over the dielectric layer by a second electroless deposition process by contacting the dielectric layer with a second plating bath having a neutral pH and comprising a metal selected from the group consisting of: copper, aluminum, silver, alloys, and combinations thereof.

An electroless plating catalyst contains: carbon material powders which include oxygen functional groups. The oxygen functional groups at least consisting of any one of lactol, ester, hydroxyl, epoxy, and ketone, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

An electroless plating catalyst contains: carbon material powders which include oxygen functional groups, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon with/without oxidization treatment. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.