A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layer 7 as a protection layer at least on a tungsten or tungsten alloy 4 formed on a bottom surface 3a of a recess 3 of a substrate 2; removing an unnecessary plating layer 7a formed on a surface 2a of the substrate 2; and forming a second plating layer 8 on the first plating layer 7 within the recess 3.

A water-soluble composition includes reducible copper ions or copper nanoparticles complexed with a reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The water-soluble composition can be used to provide various articles and electrically-conductive materials that can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxyl, lactam, phosphonic acid, or carboxylic acid group.

In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO.sub.x) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming an electrical device on a first substrate, depositing a passivation layer on the electrical device, printing a palladium-containing ink on exposed aluminum pads in or on the electrical device, converting the palladium-containing ink to a palladium-containing layer, and forming a conductive pad or bump on the palladium-containing layer. The passivation layer exposes the aluminum pads.

Methods for manufacturing electrically-conductive proppant particles are disclosed. The methods can include preparing a slurry containing water, a binder, and a raw material having an alumina content, atomizing the slurry into droplets, and coating seeds containing alumina with the droplets to form a plurality of green pellets. The green pellets can be contacted with an activation solution containing at least one catalytically active material to provide activated green pellets including the at least one catalytically active material. The method can include sintering the activated green pellets to provide a plurality of proppant particles. The plurality of proppant particles can be contacted with a plating solution containing one or more electrically-conductive material to provide electrically-conductive proppant particles.

A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition.

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.

A method for the fabrication of an electroless-metal-plated sulfur nanocomposite, an electroless-metal-plated sulfur cathode which is made from the nanocomposite, and a battery that uses the cathode, where the method includes chemically plating a conductive metal nanoshell onto the surface of the insulating sulfur powder to improve the conductivity of the sulfur cathode material, where through enhancing the electrochemical reaction kinetics with metal catalysis capabilities, and performing physical and chemical adsorption of liquid polysulfides with metal activity, the electroless-metal-plated sulfur nanocomposite enables the battery to exhibit high electrochemical utilization and stable cyclability, such that the nanocomposite can achieve a high sulfur content and high metal content, and the cathode demonstrates a high sulfur loading with a low electrolyte-to-sulfur ratio, the lithium-sulfur battery with the cathode exhibiting a high discharge capacity along with high energy density, and maintaining stable and high reversible capacity after 200 cycles within a wide range of cycling rates.

A method for electroless deposition of aluminum or an aluminum alloy on a substrate surface is provided. The method includes activating the surface of the substrate to be coated by applying a coating of a catalyst metal; preparing a mixture of urea (NH.sub.2CONH.sub.2) and anhydrous aluminum chloride (AlCl.sub.3) having a 2:1 molar ratio of AlCl.sub.3:NH.sub.2CONH.sub.2 to obtain a Lewis acid room temperature ionic liquid (RTIL) optionally containing an alloy metal salt; dissolving a hydride reducing agent in an aprotic anhydrous solvent to obtain a hydride solution; mixing the hydride solution and the AlCl.sub.3:NH.sub.2CONH.sub.2 RTIL to obtain an electroless Al solution; exposing the activated surface of the substrate to the electroless Al solution; and removing the electroless Al solution from the substrate surface; wherein upon exposure of the activated substrate surface to the electroless Al solution, an Al or Al alloy coating is obtained on the activated substrate surface.

A water-soluble composition includes reducible copper ions or copper nanoparticles complexed with a reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The water-soluble composition can be used to provide various articles and electrically-conductive materials that can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxyl, lactam, phosphonic acid, or carboxylic acid group.