A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layer 7 as a protection layer at least on a tungsten or tungsten alloy 4 formed on a bottom surface 3a of a recess 3 of a substrate 2; removing an unnecessary plating layer 7a formed on a surface 2a of the substrate 2; and forming a second plating layer 8 on the first plating layer 7 within the recess 3.

A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition.

Methods for manufacturing electrically-conductive proppant particles are disclosed. The methods can include preparing a slurry containing water, a binder, and a raw material having an alumina content, atomizing the slurry into droplets, and coating seeds containing alumina with the droplets to form a plurality of green pellets. The green pellets can be contacted with an activation solution containing at least one catalytically active material to provide activated green pellets including the at least one catalytically active material. The method can include sintering the activated green pellets to provide a plurality of proppant particles. The plurality of proppant particles can be contacted with a plating solution containing one or more electrically-conductive material to provide electrically-conductive proppant particles.

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

The present invention relates to a process for grafting polymers onto a metallic material, comprising the following steps: a) oxidation of the surface of the metallic material, resulting in an oxidized metallic material; b) grafting of a polymer at the surface of said oxidized metallic material by radical polymerization of a monomer, said radical polymerization comprising an initiation step and a propagation step, said initiation step being carried out by UV irradiation with a UV source diffusing a power at the surface of the material of greater than 72 mW.Math.cm.sup.2, said UV irradiation being carried out for a duration greater than 15 minutes and less than 180 minutes, said process resulting in a grafted metallic material. The present invention also relates to the materials capable of being obtained by this process, and applications of the latter, in particular as articular or dental implants.

An electrically conductive material with which excellent conduction reliability can be achieved for an oxide layer. The electrically conductive material contains electrically conductive particles including resin core particles, a plurality of electrically insulating particles being disposed on the surface of the resin core particles and forming protrusions, and an electrically conductive layer being disposed on the surface of the resin core particles and the electrically insulating particles, a Mohs' hardness of the electrically insulating particles being greater than 7. As a result, the electrically conductive particles pierce and sufficiently penetrate the oxide layer of the electrode surface so that excellent conduction reliability can be achieved.

Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.

Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

Provided is a method of producing a plating deposit which enables the production of a plating deposit with good adhesion to a glass substrate. Included is a method of producing a plating deposit, which includes: (1) forming a metal oxide layer on a surface of a glass substrate; (2) performing a first heat treatment after the step (1); (3) forming an electroless copper plating deposit on the metal oxide layer after the step (2); (4) performing a second heat treatment after the step (3); and (5) forming an electrolytic copper plating deposit on the electroless copper plating deposit after the step (4).