Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain aromatic heterocyclic compounds and the top coat contains hydrophobic alky organic compounds.

A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.

The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<−log(Ls)<6.0.

There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe.sub.2O.sub.4−δ, Ca.sub.0.25Cu.sub.0.75TiO.sub.3−β, and TiO.sub.2−σ, wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.

The present invention relates to a thermoplastic resin composition for a laser direct structuring process and a molded article produced therefrom. In one embodiment, the thermoplastic resin composition comprises: a polyamide resin; a polyester resin; a rubber-modified aromatic vinyl-based graft copolymer; an inorganic filler; and an additive for laser direct structuring.

A method of producing electrically conductive metallic structures in or on textiles, which has the following steps: (a) introducing at least one non-conducting precursor compound into a fibre or yarn material during or after the production thereof, wherein the at least one precursor compound is an inorganic metal phosphate compounds, a metal oxide or a spinel of the general formula AB.sub.2O.sub.4, (b) producing a textile from the fibre or yarn material, (c) irradiating the textile with electromagnetic radiation, preferably with laser light in the regions of the electrically conductive structures to be produced, with the release of metallisation seeds, and (d) electrical or non-electrical treatment of the textile with deposit of metals at the metallisation seeds with the production of conductive structures in the textile.

Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.