The conductive fine particles according to the present invention each have: a core particle containing an acrylic resin; and a silver layer provided directly on the surface of the core particle directly or provided on the surface of the core particle via a nickel layer, wherein the surface coverage rate of the silver layer is 70% or higher.

Process for pickling polyamide, comprising the steps a) contacting the polyamide with a pickling solution comprising a mixture of at least two inorganic acids MHF.sub.2, where M is an alkali ion or an ammonium ion a monocarboxylic acid with 1 to 5 carbon atoms b) contacting with an organic solvent having 1 to 10 carbon atoms, wherein steps a) and b) take place consecutively or simultaneously.

The invention relates to a process for coating plastic surfaces with metals, especially plastic surfaces composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (ABS blends), using an etch solution (composition C) comprising at least one ionic liquid IL, wherein the process comprises the treating of the plastic surface after the etching with an aqueous rinse solution RS while applying ultrasound.

It is an object to provide a technique for obtaining a wiring pattern by electroless plating without using a lift-off process. A method for manufacturing a wiring pattern characteristically includes: a base layer forming step of forming an base layer including a catalyst for electroless plating and a resin; a surface layer removing step of removing at least a part of a surface layer of the base layer; and a plating layer forming step of performing electroless plating and forming a plating layer on the base layer subjected to the surface layer removing step.

The present invention addresses the problem of providing a method for manufacturing a plated composite material, the method being capable of forming a plating layer having good adhesiveness to each of a plurality of resin parts each including a different resin. The method for manufacturing a plated composite material for solving the aforementioned problem includes: a step for preparing a composite material having a heat-resistant resin part and a silicone resin part; a step for treating, with an alkaline solution, a plating region of the composite material; a step for irradiating plasma on the plating region; a step for bringing the plating region in contact with a cationic catalyst-containing liquid; and a step for performing an electroless plating treatment on the plating region. The plating region includes at least a portion of the heat-resistant resin part and at least a portion of the silicone resin part.

Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.

Process for pickling polyamide, comprising the steps a) contacting the polyamide with a pickling solution comprising a mixture of at least two inorganic acids MHF.sub.2, where M is an alkali ion or an ammonium ion a monocarboxylic acid with 1 to 5 carbon atoms b) contacting with an organic solvent having 1 to 10 carbon atoms, wherein steps a) and b) take place consecutively or simultaneously.

A method of metallizing plastic parts, the method comprising the steps of: (a) etching a plastic part, by introducing the plastic part into an aqueous, acidic ozone etching solution, (b) metallizing the ozone etched, plastic part, and (c) heating the metallized part in an oven at an elevated temperature for a period of time. The ozone-etched and metallized plastic part after being heated in the oven exhibits increased peel strength and improved adhesion.