A method for preparing rigid polyurethane (PUR) foams or rigid polyisocyanurate (PIR) foams in which method the rigid PUR or PIR foam is prepared by reacting a composition (C) comprising: at least one isocyanate-reactive component (B1) having functional groups selected from hydroxyl, amine and thiol groups; at least one isocyanate component (A1) having an average functionality of less than 2.70; and at least one blowing agent [blowing agent (BA), herein after]; with the proviso that the overall average functionality [F.sub.n,avg(A), herein after] of all isocyanate components present in the composition (C) is less than 2.70; wherein the composition (C) is characterized by an isocyanate index X, wherein the rigid PUR or PIR foams are produced by depositing the composition (C) between two gas-tight facing sheets and wherein the rigid PUR or PIR foam is characterized by a difference Δλ between the initial thermal conductivity value λ.sub.ini and the aged thermal conductivity value λ.sub.aged of said rigid PUR or PIR foam wherein: when X≤200 then Δλ<1.35; and when X>200 then Δλ<[6.49−(4.46*F.sub.n,avg(A))−(0.02348*X)+(0.492*F.sub.n,avg(A)*F.sub.n,avg(A))+(0.01343*F.sub.n,avg(A)*X)+0.3].

Polymers suitable for forming carbon nanotube-functionalized reverse thermal gel compositions, compositions including the polymers, and methods of forming and using the polymers and compositions are disclosed. The compositions have reverse thermal gelling properties and transform from a liquid/solution to a gel—e.g., near or below body temperature. The polymers and compositions can be injected into or proximate an area in need of treatment.

Polymer polyols (“PMPOs”), processes for their production, and the use of such PMPOs, particularly in the production of flexible polyurethane foams. The PMPOs are produced using an ethylenically unsaturated composition that includes a crosslinker that results in crosslinks in the PMPO polymer particles that may decompose when exposed to flame temperatures. The PMPOs is capable of providing a flexible polyurethane foam that may exhibit combustibility resistance properties.

The present invention provides a resin composition for an adhesive, being useful as a component of an adhesive having a favorable adhesion property to glass and giving favorable appearance after adhesion. The resin composition for an adhesive contains a polyhydroxyurethane resin. This polyhydroxyurethane resin contains a structural unit formed by polymerizing a compound (A) having at least two five-membered cyclic carbonate structures and a compound (B) having at least two primary amino groups, the polyurethane resin contains a urethane bond, a hydroxy group, and a secondary amino group in the structural unit. Further, this polyhydroxyurethane resin has an amine number of 1 to 50 mgKOH/g and has a hydroxyl number of 10 to 230 mgKOH/g.

[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.

A two-component composition is described which comprises A) an isocyanate component comprising an isocyanate-terminated urethane prepolymer, B) a water component comprising water, and at least one latent amine hardener in component A). The two-component composition of the invention is suitable as a sealant, in particular as a joint sealant. Particular advantages are that primerless application is possible with good adhesion, even at low temperatures, such as 4.4° C. or below. The substrate to be sealed are preferably concrete substrates.

A belt with a tensile cord embedded in an elastomeric body, having an adhesive composition impregnating the cord and coating the fibers. The adhesive composition is the reaction product of a polyisocyanate and a polyol, or a polyurethane prepolymer derived therefrom, and a polyamine curative and optionally additional polyol, and with optionally added plasticizer. At least one of the polyisocyanate, the prepolymer, and the polyamine are blocked with a blocking agent. The belt body may be of cast polyurethane, vulcanized rubber, or thermoplastic elastomer. The cord may have an adhesive overcoat.

Disclosed is an oligomer or polymer obtained by reacting at least one monomeric, oligomeric or polymeric isocyanate having two or more isocyanate groups with 2-hydroxy-3-butenoic acid and/or at least one alkyl ester of 2-hydroxy-3-butenoic acid. A composition comprising a said oligomer or polymer is also disclosed.

In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

The present invention relates to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to an embodiment can achieve low hardness by comprising a polishing layer formed using a curing agent of specific components. It is possible to enhance the mechanical properties of the polishing pad, as well as to improve the surface defects appearing on the surface of a semiconductor substrate, by controlling the surface roughness reduction rate and the recovery elasticity index of the polishing pad to specific ranges. It is also possible to further enhance the polishing rate.